System and Method for Analyzing Athletic Activity

ABSTRACT

Various sensor systems are described herein, including inserts having sensors thereon, which are configured to be received in an article of footwear. The inserts may be connected to a sole member of the footwear, or may function as a sole member. The sensors may be bonded to an outer surface of the insert in some configurations. The system may also include an electronic module that is overmolded into the sole structure and includes a connector for external access.

CROSS-REFERENCE TO RELATED APPLICATION

The present application claims priority to and is a non-provisionalfiling of U.S. Provisional Application Ser. No. 61/801,235, filed Mar.15, 2013, which application is incorporated by reference herein in itsentirety.

TECHNICAL FIELD

The present invention generally relates to systems, apparatuses, andmethods for detecting and monitoring athletic activity and othermovement, which may utilize data input from a sensor system incorporatedinto an article of footwear.

BACKGROUND

Systems that utilize data collected from athletic activity are known.Such data can be analyzed and presented to a user in a number ofdifferent forms and formats, including by indication of performancemetrics. However, sensor systems and other hardware for gathering datafor such athletic activity present challenges, such as in construction,durability, accuracy, sensitivity, etc. Accordingly, while certainsystems for monitoring and detecting athletic activity have a number ofadvantageous features, they nevertheless have certain limitations. Thepresent invention seeks to overcome certain of these limitations andother drawbacks of the prior art, and to provide new features notheretofore available.

SUMMARY OF THE INVENTION

The following presents a general summary of aspects of the invention inorder to provide a basic understanding of the invention. This summary isnot an extensive overview of the invention. It is not intended toidentify key or critical elements of the invention or to delineate thescope of the invention. The following summary merely presents someconcepts of the invention in a general form as a prelude to the moredetailed description provided below.

General aspects of the disclosure relate to a sensor system for use withan article of footwear, including a sole member configured to form partof a sole structure of the article of footwear, a flexible insert memberpositioned in contact with the sole member, a port connected to theinsert member and configured for communication with an electronic moduleor other device, and a plurality of sensors connected to the insertmember. Each sensor is configured such that pressure on the sensorchanges a resistance of the sensor. A plurality of leads are connectedto the insert member to connect the sensors to the port. The system mayalso include an electronic module connected to the port, which isconfigured for collecting data from the sensors and for communicationwith an external device. The module may be removable from the port.

Aspects of the disclosure relate to a sensor system as described above,where the flexible insert member is a single thin, flexible sheet, andwhere each sensor includes a first layer and a second layer, with afirst contact located on the first layer and a second contact located onthe second layer, the second contact being generally aligned with thefirst contact. Each sensor is connected to an outer surface of theinsert member by a bonding material, such as an adhesive bondingmaterial. The leads may be formed by conductive traces printed on theouter surface of the insert, in one configuration.

According to one aspect, the electronic module is overmolded within thesole member and completely contained within the sole member. The systemmay also include an external connector that is electrically connected tothe electronic module, where the external connector is exposed to anexterior of the sole member and is accessible from the exterior of thesole member to provide a physical electrical connection to theelectronic module. In one configuration, the external connector may be atail that extends from a heel area of the sole member.

According to another aspect, the sole member is sealed around the insertmember. Additionally, the sole member may include upper and lowermembrane layers, and the insert member may be laminated between theupper and lower membrane layers.

According to a further aspect, the first contact of each sensor includestwo electrically separate portions, with leads connected to each of thetwo electrically separate portions, and the second contact of eachsensor engages both of the two electrically separate portions of thefirst sensor.

Additional aspects of the disclosure relate to a sensor system asdescribed above, where the flexible insert member is contained withinthe sole member, such that the sole member is sealed around the insertmember. The system may incorporate any aspects described above.

According to one aspect, each sensor includes a first layer and a secondlayer, with a first contact located on the first layer and a secondcontact located on the second layer, the second contact being generallyaligned with the first contact. The insert member may be a single thin,flexible sheet, and in this configuration, the sensors are connected toan outer surface of the insert member. Additionally, the first contactof each sensor may include two electrically separate portions, withleads connected to each of the two electrically separate portions, suchthat the second contact of each sensor engages both of the twoelectrically separate portions of the first sensor, and the leads areformed by conductive traces formed on the outer surface of the insertmember.

Further aspects of the disclosure relate to an article of footwear thatincludes an upper member at least partially defining a foot-receivingchamber, a sole structure engaged with the upper member, and a sensorsystem as described above connected to the sole structure thereof. Theinsert member of the sensor system may be received within thefoot-receiving chamber.

Other features and advantages of the invention will be apparent from thefollowing description, taken in conjunction with the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

To allow for a more full understanding of the present invention, it willnow be described by way of example, with reference to the accompanyingdrawings in which:

FIG. 1 is a side view of a shoe;

FIG. 2 is an opposed side view of the shoe of FIG. 1;

FIG. 3 is a top perspective view of a sole of a shoe (having a shoeupper removed and a foot contacting member folded aside) incorporatingone embodiment of a sensor system that is configured for use inconnection with aspects of the present invention;

FIG. 4 is a top perspective view of the sole and the sensor system ofFIG. 3, with a foot contacting member of the shoe removed and anelectronic module removed;

FIG. 5 is a schematic diagram of one embodiment of an electronic modulecapable of use with a sensor system, in communication with an externalelectronic device;

FIG. 6 is a top view of an insert of the sensor system of FIG. 3,adapted to be positioned within the sole structure of an article offootwear for a user's right foot;

FIG. 7 is a top view of the insert of FIG. 6 and a similar sensor systemadapted for use in the sole structure of an article of footwear for auser's left foot;

FIG. 8 is an exploded perspective view of the insert of FIG. 6, showingfour different layers;

FIG. 9 is a schematic circuit diagram illustrating one embodiment of acircuit formed by the components of the sensor system of FIG. 3;

FIG. 10 is a schematic diagram of a pair of shoes, each containing asensor system, in a mesh communication mode with an external device;

FIG. 11 is a schematic diagram of a pair of shoes, each containing asensor system, in a “daisy chain” communication mode with an externaldevice;

FIG. 12 is a schematic diagram of a pair of shoes, each containing asensor system, in an independent communication mode with an externaldevice;

FIG. 13 is a plot showing pressure vs. resistance for one embodiment ofa sensor according to aspects of the present invention;

FIG. 14A is a perspective view of one embodiment of a port and a housingfor connection to an electronic module, attached to an insert member;

FIG. 14B is a cross-section view of the port and housing of FIG. 14A;

FIG. 15 is a perspective view of a module according to aspects of thepresent invention;

FIG. 16 is a side view of the module of FIG. 15;

FIG. 17 is a top view of another embodiment of a sole member for anarticle of footwear incorporating one embodiment of a sensor system thatis configured for use in connection with aspects of the presentinvention;

FIG. 18A is a schematic view of one embodiment of a system of electronicconnections of the components of the sensor system illustrated in FIG.17;

FIG. 18B is a schematic view of another embodiment of a system ofelectronic connections of the components of the sensor systemillustrated in FIG. 17;

FIG. 19 is a schematic circuit diagram illustrating one embodiment of acircuit formed by the components of the sensor system of FIG. 17;

FIG. 20 is a top view of another embodiment of a sole member for anarticle of footwear incorporating one embodiment of a sensor system thatis configured for use in connection with aspects of the presentinvention;

FIG. 21 is a perspective view of an insert used with the sensor systemof FIG. 20;

FIG. 22 illustrates a sensor of the sensor system of FIG. 20, as well asa schematic illustration of the function of the sensor;

FIG. 23 is a top view of another embodiment of an insert usable with thesensor system of FIG. 20;

FIG. 24 is a top view of another embodiment of a sensor system that isconfigured for use in connection with aspects of the present invention;

FIG. 25 is a schematic view of a sensor of the sensor system of FIG. 24;

FIG. 26 is a top view of another embodiment of a sensor system that isconfigured for use in connection with aspects of the present invention;

FIG. 27 is a top view of another embodiment of a sensor system that isconfigured for use in connection with aspects of the present invention;and

FIG. 28 is a schematic illustration of a method of functioning of thesensor system of FIG. 26.

DETAILED DESCRIPTION

While this invention is susceptible of embodiment in many differentforms, there are shown in the drawings, and will herein be described indetail, preferred embodiments of the invention with the understandingthat the present disclosure is to be considered as an exemplification ofthe principles of the invention and is not intended to limit the broadaspects of the invention to the embodiments illustrated and described.

Various embodiments of sensor systems and structure for incorporatingsensor systems into articles of footwear are shown and described herein.It is understood that each such embodiment may utilize any of thefeatures described herein with respect to other embodiments, as well asany features described in U.S. patent application Ser. Nos. 13/401,918,13/401,916, and 13/401,914, filed Feb. 22, 2012; U.S. patent applicationSer. Nos. 13/399,778, 13/399,786, 13/399,916, and 13/399,935, filed Feb.17, 2012; and U.S. patent application Ser. Nos. 12/483,824 and12/483,828, filed Jun. 12, 2009, which applications are all incorporatedby reference herein.

Embodiments of sensor systems described herein may be used in connectionwith an article of footwear, such as a shoe, which is shown as anexample in FIGS. 1-2 and generally designated with the reference numeral100. The footwear 100 can take many different forms, including, forexample, various types of athletic footwear. In one exemplaryembodiment, the shoe 100 generally includes a force and/or pressuresensor system 12 operably connected to a universal communication port14. As described in greater detail below, the sensor system 12 collectsperformance data relating to a wearer of the shoe 100. Throughconnection to the universal communication port 14, multiple differentusers can access the performance data for a variety of different uses asdescribed in greater detail below.

An article of footwear 100 is depicted in FIGS. 1-2 as including anupper 120 and a sole structure 130. For purposes of reference in thefollowing description, footwear 100 may be divided into three generalregions: a forefoot region 111, a midfoot region 112, and a heel region113, as illustrated in FIG. 1. Regions 111-113 are not intended todemarcate precise areas of footwear 100. Rather, regions 111-113 areintended to represent general areas of footwear 100 that provide a frameof reference during the following discussion. Although regions 111-113apply generally to footwear 100, references to regions 111-113 also mayapply specifically to upper 120, sole structure 130, or individualcomponents included within and/or formed as part of either upper 120 orsole structure 130.

As further shown in FIGS. 1 and 2, the upper 120 is secured to solestructure 130 and defines a void or chamber for receiving a foot. Forpurposes of reference, upper 120 includes a lateral side 121, anopposite medial side 122, and a vamp or instep area 123. Lateral side121 is positioned to extend along a lateral side of the foot (i.e., theoutside) and generally passes through each of regions 111-113.Similarly, medial side 122 is positioned to extend along an oppositemedial side of the foot (i.e., the inside) and generally passes througheach of regions 111-113. Vamp area 123 is positioned between lateralside 121 and medial side 122 to correspond with an upper surface orinstep area of the foot. Vamp area 123, in this illustrated example,includes a throat 124 having a lace 125 or other desired closuremechanism that is utilized in a conventional manner to modify thedimensions of upper 120 relative the foot, thereby adjusting the fit offootwear 100. Upper 120 also includes an ankle opening 126 that providesthe foot with access to the void within upper 120. A variety ofmaterials may be used for constructing upper 120, including materialsthat are conventionally utilized in footwear uppers. Accordingly, upper120 may be formed from one or more portions of leather, syntheticleather, natural or synthetic textiles, polymer sheets, polymer foams,mesh textiles, felts, non-woven polymers, or rubber materials, forexample. The upper 120 may be formed from one or more of these materialswherein the materials or portions thereof are stitched or adhesivelybonded together, e.g., in manners that are conventionally known and usedin the art.

Upper 120 may also include a heel element (not shown) and a toe element(not shown). The heel element, when present, may extend upward and alongthe interior surface of upper 120 in the heel region 113 to enhance thecomfort of footwear 100. The toe element, when present, may be locatedin forefoot region 111 and on an exterior surface of upper 120 toprovide wear-resistance, protect the wearer's toes, and assist withpositioning of the foot. In some embodiments, one or both of the heelelement and the toe element may be absent, or the heel element may bepositioned on an exterior surface of the upper 120, for example.Although the configuration of upper 120 discussed above is suitable forfootwear 100, upper 120 may exhibit the configuration of any desiredconventional or non-conventional upper structure without departing fromthis invention.

As shown in FIG. 3, the sole structure 130 is secured to a lower surfaceof upper 120 and may have a generally conventional shape. The solestructure 130 may have a multipiece structure, e.g., one that includes amidsole 131, an outsole 132, and a foot contacting member 133. The footcontacting member 133 is typically a thin, compressible member that maybe located within the void in upper 120 and adjacent to a lower surfaceof the foot (or between the upper 120 and midsole 131) to enhance thecomfort of footwear 100. In various embodiments, the foot contactingmember 133 may be a sockliner, a strobel, an insole member, a bootieelement, a sock, etc. In the embodiment shown in FIGS. 3-4, the footcontacting member 133 is an insole member or a sockliner. The term “footcontacting member,” as used herein does not necessarily imply directcontact with the user's foot, as another element may interfere withdirect contact. Rather, the foot contacting member forms a portion ofthe inner surface of the foot-receiving chamber of an article offootwear. For example, the user may be wearing a sock that interfereswith direct contact. As another example, the sensor system 12 may beincorporated into an article of footwear that is designed to slip over ashoe or other article of footwear, such as an external bootie element orshoe cover. In such an article, the upper portion of the sole structuremay be considered a foot contacting member, even though it does notdirectly contact the foot of the user. In some arrangements, an insoleor sockliner may be absent, and in other embodiments, the footwear 100may have a foot contacting member positioned on top of an insole orsockliner.

Midsole member 131 may be or include an impact attenuating member, andmay include multiple members or elements in some embodiments. Forexample, the midsole member 131 may be formed of polymer foam material,such as polyurethane, ethylvinylacetate, or other materials (such asphylon, phylite, etc.) that compress to attenuate ground or othercontact surface reaction forces during walking, running, jumping, orother activities. In some example structures according to thisinvention, the polymer foam material may encapsulate or include variouselements, such as a fluid-filled bladder or moderator, that enhance thecomfort, motion-control, stability, and/or ground or other contactsurface reaction force attenuation properties of footwear 100. In stillother example structures, the midsole 131 may include additionalelements that compress to attenuate ground or other contact surfacereaction forces. For instance, the midsole 131 may include column typeelements to aid in cushioning and absorption of forces.

Outsole 132 is secured to a lower surface of midsole 131 in thisillustrated example footwear structure 100 and is formed of awear-resistant material, such as rubber or a flexible syntheticmaterial, such as polyurethane, that contacts the ground or othersurface during ambulatory or other activities. The material formingoutsole 132 may be manufactured of suitable materials and/or textured toimpart enhanced traction and slip resistance. The outsole 132 andmidsole 131 shown in FIGS. 1 and 2 is shown to include a plurality ofincisions or sipes 136 in either or both sides of the outsole 132,although many other types of outsoles 132 with various types of treads,contours, and other structures may be used in connection with thepresent invention. It is understood that embodiments of the presentinvention may be used in connection with other types and configurationsof shoes, as well as other types of footwear and sole structures.

FIGS. 1-4 illustrate exemplary embodiments of the footwear 100incorporating a sensor system 12 in accordance with the presentinvention, and FIGS. 3-8 illustrate exemplary embodiments of the sensorsystem 12. The sensor system 12 includes an insert member 37 having aforce and/or pressure sensor assembly 13 connected thereto. It isunderstood that the use of the insert member 37 is one embodiment, andthat an article of footwear including a different type of sensor system12 may be utilized in connection with aspects described herein. It isalso understood that insert 37 may have any number of differentconfigurations, shapes, and structures, and including a different numberand/or configuration of sensors 16, and a different insert structure orperipheral shape.

The insert member 37 is configured to be positioned in contact with thesole structure 130 of the footwear 100, and in one embodiment, theinsert member 37 is configured to be positioned underneath the footcontacting member 133 and over the top of the midsole member 131 and ingeneral confronting relation. The sensor assembly 13 includes aplurality of sensors 16, and a communication or output port 14 incommunication with the sensor assembly 13 (e.g., electrically connectedvia conductors). The port 14 is configured for communicating datareceived from the sensors 16, such as to an electronic module (alsoreferred to as an electronic control unit) 22 as described below. Theport 14 and/or the module 22 may be configured to communicate with anexternal device, as also described below. In the embodiment illustratedin FIGS. 3-8, the system 12 has four sensors 16: a first sensor 16 a atthe big toe (first phalange or hallux) area of the shoe, two sensors 16b-c at the forefoot area of the shoe, including a second sensor 16 b atthe first metatarsal head region and a third sensor 16 c at the fifthmetatarsal head region, and a fourth sensor 16 d at the heel. Theseareas of the foot typically experience the greatest degree of pressureduring movement. Each sensor 16 is configured for detecting a pressureexerted by a user's foot on the sensor 16. The sensors communicate withthe port 14 through sensor leads 18, which may be wire leads and/oranother electrical conductor or suitable communication medium. Forexample, in the embodiment of FIGS. 3-8, the sensor leads 18 may be anelectrically conductive medium that is printed on the insert member 37,such as a silver-based ink or other metallic ink, such as an ink basedon copper and/or tin. The leads 18 may alternately be provided as thinwires in one embodiment. In other embodiments, the leads 18 may beconnected to the foot contacting member 133, the midsole member 131, oranother member of the sole structure 130.

Other embodiments of the sensor system 12 may contain a different numberor configuration of sensors 16, and generally include at least onesensor 16. For example, in one embodiment, the system 12 includes a muchlarger number of sensors, and in another embodiment, the system 12includes two sensors, one in the heel and one in the forefoot of theshoe 100. In addition, the sensors 16 may communicate with the port 14in a different manner, including any known type of wired or wirelesscommunication, including Bluetooth and near-field communication. A pairof shoes may be provided with sensor systems 12 in each shoe of thepair, and it is understood that the paired sensor systems may operatesynergistically or may operate independently of each other, and that thesensor systems in each shoe may or may not communicate with each other.The communication of the sensor systems 12 is described in greaterdetail below. It is understood that the sensor system 12 may be providedwith computer programs/algorithms to control collection and storage ofdata (e.g., pressure data from interaction of a user's foot with theground or other contact surface), and that these programs/algorithms maybe stored in and/or executed by the sensors 16, the module 22, and/orthe external device 110.

The sensor system 12 can be positioned in several configurations in thesole 130 of the shoe 100. In the examples shown in FIGS. 3-4, the port14, the sensors 16, and the leads 18 can be positioned between themidsole 131 and the foot contacting member 133, such as by positioningthe insert member 37 between the midsole 131 and the foot contactingmember 133. The insert member 37 may be connected to one or both of themidsole and the foot contacting member 133 in one embodiment. A cavityor well 135 can be located in the midsole 131 and/or in the footcontacting member 133 for receiving the electronic module 22, asdescribed below, and the port 14 may be accessible from within the well135 in one embodiment. The well 135 may further contain a housing 24 forthe module 22, and the housing 24 may be configured for connection tothe port 14, such as by providing physical space for the port 14 and/orby providing hardware for interconnection between the port 14 and themodule 22. In the embodiment shown in FIGS. 3-4, the well 135 is formedby a cavity in the upper major surface of the midsole 131. As shown inFIGS. 3-4, the sole structure 130 may include a compressible sole member138 that has a hole formed therein to receive the housing 24, whichprovides access to the well 135 and/or may be considered a portion ofthe well 135. The insert 37 can be placed on top of the compressiblesole member 138 to place the housing 24 in the well 135. Thecompressible sole member 138 may confront the midsole 131 in oneembodiment, and may be in direct contact with the midsole 131. It isunderstood that the compressible sole member 138 may confront themidsole 131 with one or more additional structures positioned betweenthe compressible sole member 138 and the midsole 131, such as a strobelmember. In the embodiment of FIGS. 3-4, the compressible sole member 138is in the form of a foam member 138 (e.g. an EVA member) located betweenthe foot contacting member 133 and the midsole 131, which may beconsidered a lower insole/sockliner in this embodiment. The foam member138 may be bonded to a strobel (not shown) of the midsole 131 in oneembodiment, such as by use of an adhesive, and may cover any stitchingon the strobel, which can prevent abrasion of the insert 37 by thestitching.

In the embodiment shown in FIGS. 3-4, the housing 24 has a plurality ofwalls, including side walls 25 and a base wall 26, and also includes aflange or lip 28 that extends outward from the tops of the side walls 25and is configured for connection to the insert 37. In one embodiment,the flange 28 is a separate member that connects to a tub 29 to form thehousing 24, via pegs 28A that connect through holes 28B in the insert 37located at the front end of the hole 27. The pegs 28A may be connectedvia ultrasonic welding or other technique, and may be received inreceivers in one embodiment. In an alternate embodiment, an article offootwear 100 may be manufactured with the tub 29 formed in the solestructure 130, and the flange 28 may be later connected, such as by asnap connection, optionally after other portions of the port have alsobeen assembled. The housing 24 may include retaining structure to retainthe module 22 within the housing 24, and such retaining structure may becomplementary with retaining structure on the module 22, such as atab/flange and slot arrangement, complementary tabs, locking members,friction-fit members, etc. The housing 24 also includes a finger recess29A located in the flange 28 and/or the tub 29, which provides room forthe user's finger to engage the module 22 to remove the module 22 fromthe housing 24. The flange 28 provides a wide base engaging the top ofthe insert 37, which spreads out the forces exerted on the insert 37and/or on the foot contacting member 133 by the flange 28, which createsless likelihood of severe deflection and/or damage of such components.The rounded corners on the flange 28 also assists in avoiding damage tothe insert 37 and/or the foot contacting member 133. It is understoodthat the flange 28 may have a different shape and/or contour in otherembodiments, and may provide similar functionality with different shapesand/or contours.

The foot contacting member 133 is configured to be placed on top of thefoam member 138 to cover the insert 37, and may contain an indent 134 inits lower major surface to provide space for the housing 24, as shown inFIG. 3. The foot contacting member 133 may be adhered to the foam member138, and in one embodiment, may be adhered only in the forefoot regionto permit the foot contacting member 133 to be pulled up to access themodule 22, as shown in FIG. 3. Additionally, the foot contacting member133 may include a tacky or high-friction material (not shown) located onat least a portion of the underside to resist slippage against theinsert 37 and/or the foam member 138, such as a silicone material. Forexample, in an embodiment where the foot contacting member 133 isadhered in the forefoot region and free in the heel region (e.g. FIG.3), the foot contacting member 133 may have the tacky material locatedon the heel region. The tacky material may also provide enhanced sealingto resist penetration of dirt into the sensor system. In anotherembodiment, the foot contacting member 133 may include a door or hatch(not shown) configured to be located over the port 14 and sized topermit insertion and/or removal of the module 22 through the footcontacting member 133, which door or hatch may be opened in variousmanners, such as swinging on a hinge or removal of a plug-like element.In one embodiment, the foot contacting member 133 may also have graphicindicia (not shown) thereon, as described below.

In one embodiment, as shown in FIGS. 3-4, the foam member 138 may alsoinclude a recess 139 having the same peripheral shape as the insert 37to receive the insert 37 therein, and the bottom layer 69 (FIG. 8) ofthe insert member 37 may include adhesive backing to retain the insert37 within the recess 139. In one embodiment, a relatively strongadhesive, such as a quick bonding acrylic adhesive, may be utilized forthis purpose. The insert 37 has a hole or space 27 for receiving andproviding room for the housing 24, and the foam member 138 in thisembodiment may also allow the housing 24 to pass completely through intoand/or through at least a portion of the strobel and/or the midsole 131.In the embodiment shown in FIGS. 3-4, the foot contacting member 133 mayhave a thickness that is reduced relative to a typical foot contactingmember 133 (e.g. sockliner), with the thickness of the foam member 138being substantially equal to the reduction in thickness of the footcontacting member 133, to provide equivalent cushioning. In oneembodiment, the foot contacting member 133 may be a sockliner with athickness of about 2-3 mm, and the foam member 138 may have a thicknessof about 2 mm, with the recess 139 having a depth of about 1 mm. Thefoam member 138 may be adhesively connected to the insert member 37prior to connecting the foam member 138 to the article of footwear 100in one embodiment. This configuration permits the adhesive between thefoam member 138 and the insert 37 to set in a flat condition beforeattaching the foam member to the strobel or other portion of thefootwear 100, which is typically bends or curves the foam member 138 andmay otherwise cause delamination. The foam member 138 with the insert 37adhesively attached may be provided in this configuration as a singleproduct for insertion into an article of footwear 100 in one embodiment.The positioning of the port 14 in FIGS. 3-4 not only presents minimalcontact, irritation, or other interference with the user's foot, butalso provides easy accessibility by simply lifting the foot contactingmember 133.

In the embodiment of FIGS. 3-4, the housing 24 extends completelythrough the insert 37 and the foam member 138, and the well 135 may alsoextend completely through the strobel and partially into the midsole 131of the footwear 100 to receive the housing 24. In another embodiment,the well 135 may be differently configured, and may be positionedcompletely underneath the strobel in one embodiment, with a windowthrough the strobel to permit access to the module 22 in the well 135.The well 135 may be formed using a variety of techniques, includingcutting or removing material from the strobel and/or the midsole 131,forming the strobel and/or the midsole 131 with the well containedtherein, or other techniques or combinations of such techniques. Thehousing 24 may fit closely with the walls of the well 135, which can beadvantageous, as gaps between the housing 24 and the well 135 may besources of material failure. The process of removing the piece 135 maybe automated using appropriate computer control equipment.

The well 135 may be located elsewhere in the sole structure 130 infurther embodiments. For example, the well 135 may be located in theupper major surface of the foot contacting member 133 and the insert 37can be placed on top of the foot contacting member 133. As anotherexample, the well 135 may be located in the lower major surface of thefoot contacting member 133, with the insert 37 located between the footcontacting member 133 and the midsole 131. As a further example, thewell 135 may be located in the outsole 132 and may be accessible fromoutside the shoe 100, such as through an opening in the side, bottom, orheel of the sole 130. In the configurations illustrated in FIGS. 3-4,the port 14 is easily accessible for connection or disconnection of anelectronic module 22, as described below. In another embodiment, thefoot contacting member 133 may have the insert 37 connected to thebottom surface, and the port 14 and the well 135 may be formed in thesole structure 130. The interface 20 is positioned on the side of thehousing 24 as similarly shown with respect to other embodiments,although it is understood that the interface 20 could be positionedelsewhere, such as for engagement through the top of the module 22. Themodule 22 may be altered to accommodate such a change. Otherconfigurations and arrangements of the housing 24, the insert 37, themodule 22, and/or the interface may be utilized in further embodiments.

In other embodiments, the sensor system 12 can be positioneddifferently. For example, in one embodiment, the insert 37 can bepositioned within the outsole 132, midsole 131, or foot contactingmember 133. In one exemplary embodiment, insert 37 may be positionedwithin a foot contacting member 133 positioned above an insole member,such as a sock, sockliner, interior footwear bootie, or other similararticle, or may be positioned between the foot contacting member 133 andthe insole member. Still other configurations are possible. Asdiscussed, it is understood that the sensor system 12 may be included ineach shoe in a pair.

The insert member 37 in the embodiment illustrated in FIGS. 3-8 isformed of multiple layers, including at least a first layer 66 and asecond layer 68. The first and second layers 66, 68 may be formed of aflexible film material, such as a Mylar® or other PET (polyethyleneterephthalate) film, or another polymer film, such as polyamide. In oneembodiment, the first and second layers 66, 68 may each be PET filmshaving thicknesses of 0.05-0.2 mm, such as a thickness of 125 μm.Additionally, in one embodiment, each of the first and second layers 66,68 has a minimum bend radius of equal to or less than 2 mm. The insert37 may further include a spacer layer 67 positioned between the firstand second layers 66, 68 and/or a bottom layer 69 positioned on thebottom of the insert 37 below the second layer 68, which are included inthe embodiment illustrated in FIGS. 3-8. The layers 66, 67, 68, 69 ofthe insert 37 are stacked on top of each other and in confrontingrelation to each other, and in one embodiment, the layers 66, 67, 68, 69all have similar or identical peripheral shapes and are superimposed onone another (FIG. 8). In one embodiment, the spacer layer 67 and thebottom layer 69 may each have a thickness of 89-111 μm, such as athickness of 100 μm. The entire thickness of the insert member 37 may beabout 450 μm in one embodiment, or about 428-472 μm in anotherembodiment, and about 278-622 μm in a further embodiment. The insert 37may also include additional adhesive that is 100-225 μm thick, and mayfurther include one or more selective reinforcement layers, such asadditional PET layers, in other embodiments. Additionally, in oneembodiment, the entire four-layer insert as described above has aminimum bend radius of equal to or less than 5 mm. It is understood thatthe orientations of the first and second layers 66, 68 may be reversedin another embodiment, such as by placing the second layer 68 as the toplayer and the first layer 66 below the second layer 68. In theembodiment of FIGS. 3-8, the first and second layers 66, 68 have variouscircuitry and other components printed thereon, including the sensors16, the leads 18, resistors 53, 54, a pathway 50, dielectric patches 80,and other components, which are described in greater detail below. Thecomponents are printed on the underside of the first layer 66 and on theupper side of the second layer 68 in the embodiment of FIGS. 3-8,however in other embodiments, at least some components may be printed onthe opposite sides of the first and second layers 66, 68. It isunderstood that components located on the first layer 66 and/or thesecond layer 68 may be moved/transposed to the other layer 66, 68.

The layers 66, 67, 68, 69 can be connected together by an adhesive orother bonding material in one embodiment. The spacer layer 67 maycontain adhesive on one or both surfaces in one embodiment to connect tothe first and second layers 66, 68. The bottom layer 69 may likewisehave adhesive on one or both surfaces, to connect to the second layer 68as well as to the article of footwear 100. The first or second layers66, 68 may additionally or alternately have adhesive surfaces for thispurpose. A variety of other techniques can be used for connecting thelayers 66, 67, 68, 69 in other embodiments, such as heat sealing, spotwelding, or other known techniques.

In the embodiment illustrated in FIGS. 3-8, the sensors 16 are forceand/or pressure sensors for measuring pressure and/or force on the sole130. The sensors 16 have a resistance that decreases as pressure on thesensor 16 increases, such that measurement of the resistance through theport 14 can be performed to detect the pressure on the sensor 16. Thesensors 16 in the embodiment illustrated in FIGS. 3-8 are elliptical orobround in shape, which enables a single sensor size to be utilized inseveral different shoe sizes. The sensors 16 in this embodiment eachinclude two contacts 40, 42, including a first contact 40 positioned onthe first layer 66 and a second contact 42 positioned on the secondlayer 68. It is understood that the figures illustrating the first layer66 herein are top views, and that the electronic structures (includingthe contacts 40, the leads 18, etc.) are positioned on the bottom sideof the first layer 66 and viewed through a transparent or translucentfirst layer 66 unless specifically noted otherwise. The contacts 40, 42are positioned opposite each other and are in superimposed relation toeach other, so that pressure on the insert member 37, such as by theuser's foot, causes increased engagement between the contacts 40, 42.The resistance of the sensor 16 decreases as the engagement between thecontacts 40, 42 increases, and the module 22 is configured to detectpressure based on changes in resistance of the sensors 16. In oneembodiment, the contacts 40, 42 may be formed by conductive patches thatare printed on the first and second layers 66, 68, such as in theembodiment of FIGS. 3-8, and the two contacts 40, 42 may be formed ofthe same or different materials. Additionally, in one embodiment, theleads 18 are formed of a material that has a higher conductivity andlower resistivity than the material(s) of the sensor contacts 40, 42.For example, the patches may be formed of carbon black or anotherconductive carbon material. Further, in one embodiment, the two contacts40, 42 may be formed of the same material or two materials with similarhardnesses, which can reduce abrasion and wear due to differences inhardness of the materials in contact with each other. In thisembodiment, the first contacts 40 are printed on the underside of thefirst layer 66, and the second contacts 42 are printed on the top sideof the second layer 68, to permit engagement between the contacts 40,42. The embodiment illustrated in FIGS. 3-8 includes the spacer layer67, which has holes 43 positioned at each sensor 16 to permit engagementof the contacts 40, 42 through the spacer layer 67, while insulatingother portions of the first and second layers 66, 68 from each other. Inone embodiment, each hole 43 is aligned with one of the sensors 16 andpermits at least partial engagement between the contacts 40, 42 of therespective sensor 16. In the embodiment illustrated in FIGS. 3-8, theholes 43 are smaller in area than the sensor contacts 40, 42, allowingthe central portions of the contacts 40, 42 to engage each other, whileinsulating outer portions of the contacts 40, 42 and the distributionleads 18A from each other (See, e.g., FIG. 8). In another embodiment,the holes 43 may be sized to permit engagement between the contacts 40,42 over their entire surfaces. It is understood that the size,dimensions, contours, and structure of the sensors 16 and the contacts40, 42 may be altered in other embodiments while retaining similarfunctionality. It is also understood that sensors 16 having the samesizes may be utilized in different sizes of inserts 37 for differentshoe sizes, in which case the dimensions of the sensors 16 relative tothe overall dimensions of the insert 37 may be different for differentinsert 37 sizes. In other embodiments, the sensor system 12 may havesensors 16 that are differently configured than the sensors 16 of theembodiment of FIGS. 3-8. In a further example, the sensors 16 mayutilize a different configuration that does not include carbon-based orsimilar contacts 40, 42 and/or may not function as a resistive sensor16. Examples of such sensors include a capacitive pressure sensor or astrain gauge pressure sensor, among other examples.

As further shown in FIGS. 3-8, in one embodiment, the insert 37 mayinclude an internal airflow system 70 configured to allow airflowthrough the insert 37 during compression and/or flexing of the insert37. FIG. 8 illustrates the components of the airflow system 70 ingreater detail. The airflow system 70 may include one or more airpassages or channels 71 that lead from the sensors 16 to one or morevents 72, to allow air to flow from the sensor 16 during compression,between the first and second layers 66, 68 and outward through thevent(s) 72 to the exterior of the insert 37. The airflow system 70resists excessive pressure buildup during compression of the sensors 16,and also permits consistent separation of the contacts 40, 42 of thesensors 16 at various air pressures and altitudes, leading to moreconsistent performance. The channels 71 may be formed between the firstand second layers 66, 68. As shown in FIG. 8, the spacer layer 67 hasthe channels 71 formed therein, and the air can flow through thesechannels 71 between the first and second layers 66, 68, to theappropriate vent(s) 72. The vents 72 may have filters (not shown)covering them in one embodiment. These filters may be configured topermit air, moisture, and debris to pass out of the vents 72 and resistmoisture and debris passage into the vents 72. In another embodiment,the insert 37 may not contain a spacer layer, and the channels 71 may beformed by not sealing the layers 66, 68 together in a specific pattern,such as by application of a non-sealable material. Thus, the airflowsystem 70 may be considered to be integral with or directly defined bythe layers 66, 68 in such an embodiment. In other embodiments, theairflow system 70 may contain a different number or configuration of airchannels 71, vents 72, and/or other passages.

In the embodiment illustrated in FIGS. 3-8, the airflow system 70includes two vents 72 and a plurality of air channels 71 connecting eachof the four sensors 16 to one of the vents 72. The spacer layer 67includes holes 43 at each sensor in this embodiment, and the channels 71are connected to the holes 43 to permit air to flow away from the sensor16 through the channel 71. Additionally, in this embodiment, two of thesensors 16 are connected to each of the vents 72 through channels 71.For example, as illustrated in FIGS. 4 and 8 the first metatarsal sensor16 b has a channel 71 that extends to a vent 72 slightly behind thefirst metatarsal area of the insert 37, and the first phalangeal sensor16 a has a channel 71 that also extends to the same vent 72, via apassageway that includes traveling through the first metatarsal sensor16 b. In other words, the first phalangeal sensor 16 a has a channel 71that extends from the hole 43 at the first phalangeal sensor 16 a to thehole 43 at the first metatarsal sensor 16 b, and another channel 71extends from the first metatarsal sensor 16 b to the vent 72. The fifthmetatarsal sensor 16 c and the heel sensor 16 d also share a common vent72, located in the heel portion of the insert 37. One channel 71 extendsrearward from the hole 43 at the fifth metatarsal sensor 16 c to thevent 72, and another channel 71 extends forward from the hole 43 at theheel sensor 16 d to the vent 72. Sharing the vents 72 among multiplesensors can decrease expense, particularly by avoiding the need foradditional filters 73. In other embodiments, the airflow system 70 mayhave a different configuration. For example, each sensor 16 may have itsown individual vent 72, or more than two sensors 16 may share the samevent 72, in various embodiments.

Each vent 72 is formed as an opening in a bottom side of the secondlayer 68 (i.e. opposite the first layer 66), such that the openingpermits outward flow of air, moisture, and/or debris from the airflowsystem 70, as seen in FIG. 8. In another embodiment, the vent 72 mayinclude multiple openings. In a further embodiment, the vent 72 mayadditionally or alternately be formed by an opening in the first layer66, causing the air to vent upwards out of the insert 37. In anadditional embodiment, the vent 72 may be on the side (thin edge) of theinsert 37, such as by extending the channel 71 to the edge, such thatthe channel 71 opens through the edge to the exterior of the insert 37.The venting of the air downward, as in the embodiment illustrated inFIGS. 3-8, makes it more difficult for debris to enter the vent 72. Thebottom layer 69, if present, also includes apertures 74 located belowthe vents 72, to permit the air flowing out of the vents 72 to passthrough the bottom layer 69. The apertures 74 are significantly largerthan the vents 72, in order to allow filters to be adhesively attachedto the second layer 68 through the bottom layer 69 around the peripheryof each vent 72, as described below. Additionally, in this embodiment,each vent 72 has a reinforcement material 75 positioned around the vent72, to add stability and strength to the material and preventbreaking/tearing. In the embodiment illustrated, the reinforcementmaterial 75 is formed of the same material as the leads 18 (e.g. silveror other metallic ink) to facilitate printing, but may also be formed ofthe same material as the sensor contacts 40, 42 (e.g. carbon) or thedielectric material discussed herein.

The vents 72 in the embodiment illustrated in FIGS. 3-8 open downwardand the air passing through the vents 72 passes downward toward themidsole 131 and toward the foam member 138 if present. In the embodimentillustrated in FIGS. 3-4, the foam member 138 has cavities 76 locateddirectly below the vents 72 and configured such that the air exiting thevents passes into the respective cavity 76. Such cavities 76 may beformed as a slot that extends completely or partially through the foammember 138. This configuration allows air to pass out of the vents 72without obstruction from the foam member 138. In the embodiment of FIGS.3-4, each of the cavities 76 has a channel portion 77 extendinglaterally away from the cavity 76 and beyond the peripheral boundary ofthe insert 37. In other words, the channel portion 77 of the cavity 76extends laterally from the vent 72 to a distal end 78 located outsidethe peripheral boundary of the insert 37. It is understood that if thefoam member 138 has a recess 139 to receive the insert member 37, thedistal end 78 of the channel portion 77 of the cavity 76 may also belocated outside the peripheral boundary of the recess 139, as in theembodiment shown in FIGS. 3-4. This configuration permits air passinginto the cavity 76 to exit the sole structure 130 by passing laterallythrough the channel portion 77 and then upward and/or outward away fromthe foam member 138. In another embodiment, the distal end 78 may stopat a point within the foam member 138 and still outside the peripheralboundary of the insert 37, which allows the air to vent upward out ofthe cavity 76 at the distal end 78 and provides the same or similarfunctionality. As stated above, the components of the airflow system 70may be configured different in other embodiments.

Additionally, the foot contacting member 133 includes one or morepassages (not shown) extending through the foot contacting member 133located at the distal end 78 of the cavity 76, in the embodiment ofFIGS. 3-8. The passages may be pinhole-type passages that extendvertically through the foot contacting member 133. In anotherembodiment, a different type of passage may be used, including slits orgrooves, and at least one passage may extend laterally to a side of thefoot contacting member 133, rather than upward through the thickness ofthe foot contacting member 133. The passages allow the air exitingthrough the vent 72 and outward through the cavity 76 to pass throughthe foot contacting member 133 and out of the sole structure 130. Inanother embodiment, the foot contacting member 133 may not include anypassage(s). The foot contacting member 133 may still provide ventilationin a configuration without any passage(s), such as by using a breathablefoam or other breathable material for constructing the foot contactingmember 133.

In the embodiment of FIGS. 3-8, as described above, the spacer layer 67generally insulates conductive members/components on the first andsecond layers 66, 68 from each other, except in areas where electricalcontact is desired, such as at the pathway 50 and between the contacts40, 42 of the sensors 16. The spacer layer 67 has holes 38, 43 to defineareas of desired electrical contact between the layers 66, 68. Thecomponents of the airflow system 70, in particular the channels 71 mayprovide a route for shorting or other undesired electrical contact byone or more conductive members between the first and second layers 66,68. In one embodiment, the sensor system 12 may include one or morepatches of dielectric material 80 to resist or prevent undesiredshorting by one or more conductive members across open areas of thespacer layer 67, such as the channels 71. This dielectric material 80may be in the form of an acrylic ink or other UV-curable ink, or anotherinsulating material suitable for the application. In the embodimentshown in FIGS. 3-8, the insert 37 has several patches of dielectricmaterial 80 extending across the channel 71, to insulate thedistribution leads 18A located around the sensor contacts 40, 42 fromeach other.

In the embodiment of FIGS. 3-8, the port 14, the sensors 16, and theleads 18 form a circuit 10 on the insert member 37. The port 14 has aplurality of terminals 11, with four of the terminals 11 each dedicatedto one of the four sensors 16 individually, one terminal 11 for applyinga voltage to the circuit 10, and one terminal 11 for voltagemeasurement. In this embodiment, the sensor system 12 also includes apair of resistors 53, 54, each located on one of the layers 66, 68, anda pathway 50 connecting the circuitry on the first layer 66 with thecircuitry on the second layer 68. The resistors 53, 54 provide areference point for the module 22 to measure the resistance of eachsensor 16, and permit the module 22 to convert the variable current fromthe active sensor 16 into a measurable voltage. Additionally, theresistors 53, 54 are arranged in parallel within the circuit 10, whichcompensates for variations in the circuit 10 and/or variations in themanufacturing processes used to create the resistors 53, 54, such asvariations in conductivity of the inks used to print the leads 18 and/orthe sensor contacts 40, 42. In one embodiment, the equivalent resistanceof the two resistors 53, 54 is 1500+/−500 kΩ. In another embodiment, asingle resistor 53, 54 or two resistors 53, 54 in series could be used.In a further embodiment, the resistors 53, 54 may be positionedelsewhere on the insert 37, or may be located within the circuitry ofthe module 22. A more technical depiction of the circuit 10 of thisembodiment is described below and shown in FIG. 20.

FIG. 9 illustrates a circuit 10 that may be used to detect and measurepressure in accordance with an embodiment of the invention. The circuit10 includes six terminals 104 a-104 f, including a power terminal 104 afor applying a voltage to the circuit 10, a measurement terminal 104 bfor measuring a voltage as described below, and four sensor terminals104 c-104 f, each of which is dedicated to one of the sensors 16 a-16 dindividually, and each of which represents ground in this embodiment.The terminals 104 a-104 f represent the terminals 11 of the port 14. Inthe embodiment shown, fixed resistors 102 a and 102 b, which representresistors 53 and 54, are connected in parallel. Fixed resistors 102 aand 102 b may be physically located on separate layers. The equivalentresistance across terminals 104 a and 104 b is determined by thewell-known equation of:

R _(eq) =R _(12a) ·R _(102b)/(R _(102a) +R _(102b))  (Equation 1)

Where:

-   -   R_(102a)=Resistance of fixed resistors 102 a    -   R_(102b)=Resistance of fixed resistors 102 b    -   R_(eq)=Equivalent resistance

Electrically connecting fixed resistors 102 a and 102 b in parallelcompensates for variations in the manufacturing processes used to createfixed resistors 102 a and 102 b. For example, if fixed resistor 102 ahas a resistance that deviates from a desired resistance, the deviationof the equivalent resistance determined by equation 1 is minimized bythe averaging effect of fixed resistor 102 b. One skilled in the artwill appreciate that two fixed resistors are shown for illustrationpurposes only. Additional fixed resistors may be connected in paralleland each fixed resistor may be formed on a different layer.

In the embodiment shown in FIG. 9, fixed resistors 102 a and 102 b areconnected to sensors 16 a-16 d. Sensors 16 a-16 d may be implementedwith variable resistors that change resistance in response to changes inpressure, as described above. Each of sensors 16 a-16 d may beimplemented with multiple variable resistors. In one embodiment, each ofsensors 16 a-16 d is implemented with two variable resistors which arephysically located on different layers and electrically connected inparallel. For example, as described above with respect to oneembodiment, each sensor 16 a-16 d may contain two contacts 40, 42 thatengage each other to a greater degree as applied pressure increases, andthe resistance of the sensor 16 a-16 d may decrease as the engagementincreases. As mentioned above, connecting resistors in parallel createsan equivalent resistance that minimizes deviations created duringmanufacturing processes. In another embodiment, the contacts 40, 42 maybe arranged in series. Sensors 16 a-16 d may be connected to ground viaswitches 108 a-108 d. Switches 108 a-108 d may be closed one at a timeto connect a sensor. In some embodiments, switches 108 a-108 d areimplemented with transistors or integrated circuits.

In operation a voltage level, such as 3 volts, is applied at terminal104 a. Switches 108 a-108 d are closed one at a time to connect one ofsensors 16 a-16 d to ground. When connected to ground, each of sensors16 a-16 d forms a voltage divider with the combination of fixedresistors 102 a and 102 b. For example, when switch 108 a is closed, thevoltage between terminal 104 a and ground is divided between thecombination of fixed resistors 102 a and 102 b and sensor 16 a. Thevoltage measured at terminal 104 b changes as the resistance of sensor16 a changes. As a result, pressure applied to sensor 16 a may bemeasured as a voltage level at terminal 104 b. The resistance of thesensor 16 a is measured utilizing the voltage applied to the sensor 16 ain series with the combined fixed resistors 104 a and 104 b of knownvalue. Similarly, selectively closing switches 108 b-108 d will generatevoltage levels at terminal 104 b that are related to the pressureapplied at sensors 16 b-16 d. It is understood that the connectionsbetween the sensors 16 a-d and the terminals 104 c-f may be different inother embodiments. For example, the sensors 16 a-d are connected todifferent pins of the interface 20 in the left shoe insert 37 ascompared to the right shoe insert 37, as shown in FIG. 8. In anotherembodiment, the voltage level may be applied in the opposite manner,with the ground located at terminal 104 a and the voltage applied atterminals 104 c-f. In further embodiments, another circuit configurationmay be used to achieve a similar result and functionality.

The two resistors 53, 54 have similar or identical structures in theembodiment illustrated, however it is understood that the resistors mayhave different structures in other embodiments. Each resistor 53, 54 hastwo sections 55, 56 spaced from each other and a bridge 57 positionedbetween and connecting the sections 55, 56. In one embodiment, thebridge 57 may be formed of a more resistive material than the sections55, 56, and may thus provide the majority of the resistance of eachresistor 53, 54. The sections 55, 56 may be at least partially formed ofa high-conductivity material, such as a silver material. In theembodiment illustrated in FIGS. 3-9, the inner and outer sections 55, 56are formed of the same material as the leads 18, such as a printedsilver-based or other metallic-based ink. In this embodiment, the bridge57 is formed of the same material as the sensor contacts 40, 42, such ascarbon black or another conductive carbon material. It is understoodthat the inner and outer sections 55, 56 and/or the bridge 57 may beformed of different materials in other embodiments.

The pathway 50 generally permits continuous and/or uninterruptedelectrical communication and passes electronic signals between the firstand second layers 66, 68. In the embodiment of FIGS. 3-8, the port 14 isdirectly connected to the second layer 68, and the pathway 50 may serveas a vertical path between the port 14 and the sensor contacts 40 on thefirst layer 66, 68. In this embodiment, the pathway 50 includesconductive portions 51 on the first layer 66 and the second layer 68,such that conductive portions 51 may be in continuous engagement witheach other to provide continuous electrical communication between thefirst and second layers 66, 68. The spacer layer 67 in this embodimentincludes a hole 38 that is aligned with the pathway 50 and allows forcontinuous engagement between the conductive portions 51 through thespacer layer 67. Additionally, in the embodiment of FIGS. 3-5, each ofthe conductive portions 51 is divided into two sections 52 that areseparated by an elongated gap 59. The gap 59 may be oriented to increasethe durability of the pathway 50 during flexing of the insert 37, byserving as a flexing point to minimize bending of the conductiveportions 51. The conductive portions 51 of the pathway 50 are formed ofa conductive material, and in one embodiment, the conductive portions 51may be formed of the same material as the leads 18, such as asilver-based ink or other metallic ink. In other embodiments, thepathway 50, and the components thereof described herein, may have adifferent size, shape, form, or location, and may be formed of adifferent material. Additionally, the pathway 50 may be at leastpartially surrounded by or bounded by a stiffening structure 60 in oneembodiment to provide structural support and/or effects, such asassisting with engagement between the conductive portions 51. Asillustrated in FIGS. 3-8, the conductive portions 51 are surrounded by asubstantially annular stiffener 60. The stiffener 60 may be formed ofany material that has suitable stiffness, and in one embodiment, may beformed of a material with greater stiffness than the material of theconductive portions 51, such as carbon black or other carbon-basedmaterial. Further, the hole 38 in the spacer layer 67 permits theconductive portions 51 to engage each other.

The insert 37 may be constructed by depositing the various components ona polymer (e.g. PET) film. In one embodiment, the insert 37 isconstructed by first depositing the conductive metallic material on eachlayer 66, 68, such as by printing in the traced pattern of the leads 18(including the distribution lead 18A, the conductive portions 51 of thepathway 50, the inner and outer sections 55, 56 of the resistors 53, 54,etc. The additional carbon material can then be deposited on each layer66, 68, such as by printing, to form the contacts 40, 42, the stiffener60 of the pathway 50, the bridge 57 of the resistors 53, 54, etc. Anyadditional components can then be deposited, such as any dielectricportions. The layers 66, 68 may be printed on PET sheets and then cutout to form the outer peripheral shape after printing in one embodiment.

The port 14 is configured for communication of data collected by thesensors 16 to an outside source, in one or more known manners. In oneembodiment, the port 14 is a universal communication port, configuredfor communication of data in a universally readable format. In theembodiments shown in FIGS. 3-8 and 14, the port 14 includes an interface20 for connection to an electronic module 22, shown in connection withthe port 14 in FIG. 3. Additionally, in this embodiment, the port 14 isassociated with the housing 24 for insertion of the electronic module22, located in the well 135 in the middle arch or midfoot region of themidsole 131. As illustrated in FIGS. 3-8, the sensor leads 18 convergetogether to form a consolidated interface 20 at their terminals 11, inorder to connect to the port 14. In one embodiment, the consolidatedinterface may include individual connection of the sensor leads 18 tothe port interface 20, such as through a plurality of electricalcontacts. In another embodiment, the sensor leads 18 could beconsolidated to form an external interface, such as a plug-typeinterface or another configuration, and in a further embodiment, thesensor leads 18 may form a non-consolidated interface, with each lead 18having its own separate terminal 11. As also described below, the module22 may have an interface 23 for connection to the port interface 20and/or the sensor leads 18.

In the embodiments shown in FIGS. 3-8 and 14, the interface 20 takes theform of electrical contacts or terminals 11. In one embodiment, theterminals 11 are formed on a tongue or extension 21 that extends fromone of the layers 66, 68 into the hole 27 provided for the housing 24.The extension consolidates the ends of the leads 18 to a single area toform the interface 20. In the embodiment of FIGS. 3-8 and 14, theextension 21 extends from the second layer 68 into the hole 27, and isbent downward within the housing 24 to place the terminals 11 within thehousing 24 and make the interface 20 accessible within the housing 24.The extension 21 may pass underneath the flange 28 of the housing 24 andthrough a slot or other space underneath the lip 28 in order to extendinto the housing 24. In the configuration illustrated in FIGS. 3-8 and14, the extension 21 bends downwardly into the well 135 and into thehousing 24, as discussed above, to place the terminals 11 within thehousing 24 and forming the interface 20 within the housing 24.

The housing 24 may contain connection structure, such as connector pinsor springs for establishing connection between the interface 20 and themodule 22, as shown in FIG. 14. In one embodiment, the port 14 includesan electrical connector 82 forming the interface 20, which may includecontacts that individually attach to the terminals 11, as mentionedabove. The connector 82 may connect to the extension 21 and theterminals 11 via a crimping connection. The interface 20 in thisembodiment includes seven terminals: four terminals 11 each individuallyconnected to one of the sensors 16, one terminal 11 serving as themeasurement terminal (104 b in FIG. 20), and one terminal serving as apower terminal (104 a in FIG. 20) to apply a voltage to the circuit 10.As discussed above, the power terminal may instead be configured as aground terminal in another embodiment, with the sensor terminals (104c-f in FIG. 20) being configured as power terminals. The seventhterminal may be utilized for powering of accessories, such as a uniqueidentification chip 92 (see FIG. 14B). In one embodiment, the sixth andseventh terminals 11 are extended on a tail 21A that extends from theend of the extension 21. An accessory may be connected across the twoterminals 11 on the tail 21A to power the accessory. The accessory mayinclude a small printed circuit board (PCB) with a memory chip that areattached via anisotropic contact formation to the tail 21A. In oneembodiment, an accessory chip may include information uniquelyidentifying the article of footwear 100, such as a serial number, aswell as substantive information such as whether the footwear 100 is aleft or right shoe, a men's or women's shoe, a specific type of shoe(e.g. running, tennis, basketball, etc.), and other types ofinformation. This information may be read by the module 22 andsubsequently used in analysis, presentation, and/or organization of datafrom the sensors. The accessory may be sealed into the housing 24, suchas via epoxy or other material.

The port 14 is adapted for connection to a variety of differentelectronic modules 22, which may be as simple as a memory component(e.g., a flash drive) or which may contain more complex features. It isunderstood that the module 22 could be as complex a component as apersonal computer, mobile device, server, etc. The port 14 is configuredfor transmitting data gathered by the sensors 16 to the module 22 forstorage, transmission, and/or processing. In some embodiments, the port14, the sensors 16, and/or other components of the sensor system 12 maybe configured for processing the data. The port 14, sensors 16, and/orother components of the sensor system 12 may additionally or alternatelybe configured for transmission of data directly to an external device110 or a plurality of modules 22 and/or external devices 110. It isunderstood that the port 14, the sensors 16, and/or other components ofthe sensor system 12 may include appropriate hardware, software, etc.,for these purposes. Examples of a housing and electronic modules in afootwear article are illustrated in U.S. patent application Ser. No.11/416,458, published as U.S. Patent Application Publication No.2007/0260421, which is incorporated by reference herein and made parthereof. Although the port 14 is illustrated with electronic terminals 11forming an interface 20 for connection to a module 22, in otherembodiments, the port 14 may contain one or more additional or alternatecommunication interfaces. For example, the port 14 may contain orcomprise a USB port, a Firewire port, 16-pin port, or other type ofphysical contact-based connection, or may include a wireless orcontactless communication interface, such as an interface for Wi-Fi,Bluetooth, near-field communication, RFID, Bluetooth Low Energy, Zigbee,or other wireless communication technique, or an interface for infraredor other optical communication technique. In another embodiment, thesensor system 12 may include more than one port 14 configured forcommunication with one or more modules 22 or external devices 110. Thisconfiguration may alternately be considered to be a single distributedport 14. For example, each of the sensors 16 may have a separate port 14for communication with one or more electronic modules 22. The ports 14in this embodiment are connected to the sensors 16 by leads 18 and maybe located between the layers of the insert 37, within a hole in theinsert 37, or above or below the insert 37 in various embodiments. It isunderstood that multiple or distributed port(s) 14 may be used, withcombinations of two or more sensors connected to a single port 14. Infurther embodiments, the sensor system 12 may include one or more ports14 having different configurations, which may include a combination oftwo or more configurations described herein.

The module 22 may additionally have one or multiple communicationinterfaces for connecting to an external device 110 to transmit the datafor processing, as described below and shown in FIG. 5. Such interfacescan include any of the contacted or contactless interfaces describedabove. In one example, the module 22 includes at least a retractable USBconnection for connection to a computer and/or for charging a battery ofthe module 22. In another example, the module 22 may be configured forcontacted or contactless connection to a mobile device, such as a watch,cell phone, portable music player, etc. The module 22 may be configuredfor wireless communication with the external device 110, which allowsthe device 22 to remain in the footwear 100. However, in anotherembodiment, the module 22 may be configured to be removed from thefootwear 100 to be directly connected to the external device 110 fordata transfer, such as by the retractable USB connection describedabove. In a wireless embodiment, the module 22 may be connected to anantenna for wireless communication. The antenna may be shaped, sized,and positioned for use with the appropriate transmission frequency forthe selected wireless communication method. Additionally, the antennamay be located internally within the module 22 or external to themodule. In one example, the sensor system 12 itself (such as the leads18 and conductive portions of the sensors 16) could be used to form anantenna. The module 22 may further be placed, positioned, and/orconfigured in order to improve antenna reception, and in one embodiment,may use a portion of the user's body as an antenna. In one embodiment,the module 22 may be permanently mounted within the footwear 100, oralternately may be removable at the option of the user and capable ofremaining in the footwear 100 if desired. Additionally, as furtherexplained below, the module 22 may be removed and replaced with anothermodule 22 programmed and/or configured for gathering and/or utilizingdata from the sensors 16 in another manner. If the module 22 ispermanently mounted within the footwear 100, the sensor system 12 mayfurther contain an external port (not shown) to allow for data transferand/or battery charging, such as a USB or Firewire port. It isunderstood that the module 22 may be configured for both contacted andcontactless communication.

While the port 14 may be located in a variety of positions withoutdeparting from the invention, in one embodiment, the port 14 is providedat a position and orientation and/or is otherwise structured so as toavoid or minimize contact with and/or irritation of the wearer's foot,e.g., as the wearer steps down in and/or otherwise uses the article offootwear 100, such as during an athletic activity. The positioning ofthe port 14 in FIGS. 3-4 and 14 illustrates one such example. In anotherembodiment, the port 14 is located proximate the heel or instep regionsof the shoe 100. Other features of the footwear structure 100 may helpreduce or avoid contact between the wearer's foot and the port 14 (or anelement connected to the port 14) and improve the overall comfort of thefootwear structure 100. For example, as described above and illustratedin FIGS. 3-4, the foot contacting member 133 may fit over and at leastpartially cover the port 14, thereby providing a layer of paddingbetween the wearer's foot and the port 14. Additional features forreducing contact between the port 14 and the wearer's foot andmodulating any undesired feel of the port 14 at the wearer's foot may beused.

FIG. 14 shows a further view of one embodiment of the port 14 configuredto be utilized with the insert member 37. Similar structures describedabove will be designated with identical or similar reference numerals.This embodiment and variations of the embodiment are described in detailbelow. As discussed and disclosed herein, the port 14 defines orsupports an interface 20 for an operable connection with the module 22.The module 22 will also be described in greater detail below. Throughthe operable connection between the port 14 and the module 22, datasensed by the sensor assembly 12 can be acquired, stored and/orprocessed for further use and analysis.

As further shown in FIG. 14, the housing 24 in this embodiment includesa base member 140 and a cover member 142. The base member 140 maycorrespond to the tub 29 as described above that defines the side walls25 and the base wall 26. The cover member 142 has a central aperture 153dimensioned to receive the module 22 therethrough. An underside of thecover member 142 has a pair of depending posts (not shown) thatcooperate with receivers (not shown) on the base member 140 as will bedescribed. An outer periphery of the cover member 142 defines the lip orflange 28. In an exemplary embodiment, the cover member 142 may havedepending walls that cooperatively define the side walls 25 of thehousing 24. In such configuration, the base member 140 may define aledge on the side wall to receive the depending walls on the covermember 142.

FIG. 14 further shows components of the interface assembly 156. Theinterface assembly 156 has a carrier 157 that supports the electricalconnectors 82 such as described schematically in reference to FIG. 32.The electrical connectors 82 each have a distal end defining a contactthat is resiliently supported by the carrier 157 that will cooperatewith a corresponding contact on the module 22. As shown in FIG. 14, theinterface assembly 156 is operably connected to the extension 21 havingthe leads 11 thereon of the insert member 37. As further shown in FIG.14B, it is understood that the tail 21A can be further folded over to bepositioned adjacent a back side of the extension 21. As further shown inFIG. 14, the carrier 157 is positioned in a first lateral slot 148 ofthe base member 140 of the housing 24. As can be appreciated from FIG.14B, a filler material 159 (e.g. a potting compound) may be injectedinto a second lateral slot 150 behind the carrier 157. Thisconfiguration places the connectors 82 of the interface 20 exposedwithin the tub 29 for connection to the module 22.

FIGS. 15-16 disclose additional views and features of one embodiment ofthe module 22. As previously discussed, the module 22 is received by andis operably connected to the port 14 to collect, store and/or processdata received from the sensor assembly 12. It is understood that themodule 22 houses various components for such purposes including but notlimited to, printed circuit boards, power supplies, light members,interfaces, and different types of sensors, including multi-axisaccelerometer, gyroscopes and/or magnetometers. The module 22 generallyincludes a housing 170 that supports an interface assembly 171 formingthe interface 23, and having electrical connectors that form contactsfor cooperation with the interface 20 of the port 14. The interfaceassembly 171 has a plurality of connectors 172 and a module carrier 173.The connectors 172 each have distal ends that form contacts thatcollectively define the interface 23 of the module 22. It is understoodthat the connectors 172 may be insert molded such that material isformed around the connectors 172 to define the module carrier 173. Thehousing 170 generally has a module base member 175, which may includemultiple members (e.g., outer and inner members). The housing 170further has a module top member 177, which may also include multiplemembers (e.g., outer and inner top members). The module base member 175,the module top member 177, and interface assembly 171 cooperate toprovide a sealed configuration around the connectors 172. The connectors172 may be considered to have an over-molded configuration in thisembodiment. These components also form an inner cavity wherein thehousing 170 supports internal components including a printed circuitboard that is operably connected to the connectors 172.

It is understood that the module 22 is received in the port 14. A frontend of the module 22 is inserted through the central aperture 153 andinto the first section 144. The module 22 is dimensioned to generallycorrespond in size to the tub 29 in an interference fit. In suchconfiguration, the interface 23 on the module 22 is operably engagedwith the interface 20 on the port 14 wherein the respective contacts ofthe interfaces 20, 23 are in surface-to-surface contact. Thus, theconstruction is such that the interface 23 of the module 22 is forcedagainst the interface 20 of the port 14. The module 22 may have a recess184 on a rear surface that may receive a projection on the housing 24 toassist in retaining the module 22 in the port 14 through a snapconnection. A user can easily remove the module 22 from the port byaccessing the module 22 with the assistance of a finger recess 29A.Thus, the modules 22 can easily be inserted into the port 14 and removedfrom the port 14 when necessary such as for charging or transferringdata, or when replacing one type of module 22 for one application with adifferent type of module for a different application, or replacing apower drained module 22 with a freshly charged module 22.

FIG. 5 shows a schematic diagram of an example electronic module 22including data transmission/reception capabilities through a datatransmission/reception system 107, which may be used in accordance withat least some examples of this invention. While the example structuresof FIG. 5 illustrate the data transmission/reception system (TX-RX) 107as integrated into the electronic module structure 22, those skilled inthe art will appreciate that a separate component may be included aspart of a footwear structure 100 or other structure for datatransmission/reception purposes and/or that the datatransmission/reception system 107 need not be entirely contained in asingle housing or a single package in all examples of the invention.Rather, if desired, various components or elements of the datatransmission/reception system 107 may be separate from one another, indifferent housings, on different boards, and/or separately engaged withthe article of footwear 100 or other device in a variety of differentmanners without departing from this invention. Various examples ofdifferent potential mounting structures are described in more detailbelow.

In the example of FIG. 5, the electronic component 22 may include a datatransmission/reception element 107 for transmitting data to and/orreceiving data from one or more remote systems. In one embodiment, thetransmission/reception element 107 is configured for communicationthrough the port 14, such as by the contacted or contactless interfacesdescribed above. In the embodiment shown in FIG. 5, the module 22includes an interface 23 configured for connection to the port 14 and/orsensors 16. In the module 22 illustrated in FIG. 5, the interface 23 hascontacts that are complementary with the terminals 11 of the interface20 of the port 14, to connect with the port 14. In other embodiments, asdescribed above, the port 14 and the module 22 may contain differenttypes of interfaces 20, 23, which may be contacted or wireless. It isunderstood that in some embodiments, the module 22 may interface withthe port 14 and/or sensors 16 through the TX-RX element 107.Accordingly, in one embodiment, the module 22 may be external to thefootwear 100, and the port 14 may comprise a wireless transmitterinterface for communication with the module 22. The electronic component22 of this example further includes a processing system 202 (e.g., oneor more microprocessors), a memory system 204, and a power supply 206(e.g., a battery or other power source). In one embodiment, the powersupply 206 may be configured for inductive charging, such as byincluding a coil or other inductive member. In this configuration, themodule 22 may be charged by placing the article of footwear 100 on aninductive pad or other inductive charger, allowing charging withoutremoval of the module 22 from the port 14. In another embodiment, thepower supply 206 may additionally or alternately be configured forcharging using energy-harvesting technology, and may include a devicefor energy harvesting, such as a charger that charges the power supply206 through absorption of kinetic energy due to movement of the user.

Connection to the one or more sensors can be accomplished as shown inFIG. 5, but additional sensors (not shown) may be provided to sense orprovide data or information relating to a wide variety of differenttypes of parameters, such as physical or physiological data associatedwith use of the article of footwear 100 or the user, including pedometertype speed and/or distance information, other speed and/or distance datasensor information, temperature, altitude, barometric pressure,humidity, GPS data, accelerometer output or data, heart rate, pulserate, blood pressure, body temperature, EKG data, EEG data, dataregarding angular orientation and changes in angular orientation (suchas a gyroscope-based sensor), etc., and this data may be stored inmemory 204 and/or made available, for example, for transmission by thetransmission/reception system 107 to some remote location or system. Theadditional sensor(s), if present, may also include an accelerometer(e.g., for sensing direction changes during steps, such as for pedometertype speed and/or distance information, for sensing jump height, etc.).In one embodiment, the module 22 may include an additional sensor 208,such as an accelerometer, and the data from the sensors 16 may beintegrated with the data from the accelerometer 208, such as by themodule 22 or the external device 110.

As additional examples, electronic modules, systems, and methods of thevarious types described above may be used for providing automatic impactattenuation control for articles of footwear. Such systems and methodsmay operate, for example, like those described in U.S. Pat. No.6,430,843, U.S. Patent Application Publication No. 2003/0009913, andU.S. Patent Application Publication No. 2004/0177531, which describesystems and methods for actively and/or dynamically controlling theimpact attenuation characteristics of articles of footwear (U.S. Pat.No. 6,430,843, U.S. Patent Application Publication No. 2003/0009913, andU.S. patent application Publication No. 2004/0177531 are each entirelyincorporated herein by reference and made part hereof). When used forproviding speed and/or distance type information, sensing units,algorithms, and/or systems of the types described in U.S. Pat. Nos.5,724,265, 5,955,667, 6,018,705, 6,052,654, 6,876,947 and 6,882,955 maybe used. These patents each are entirely incorporated herein byreference. Additional embodiments of sensors and sensor systems, as wellas articles of footwear and sole structures and members utilizing thesame, are described in U.S. Patent Application Publications Nos.2010/0063778 and 2010/0063779, which applications are incorporated byreference herein in their entireties and made part hereof.

The electronic module 22 can also include an activation system (notshown). The activation system or portions thereof may be engaged withthe module 22 or with the article of footwear 100 (or other device)together with or separate from other portions of the electronic module22. The activation system may be used for selectively activating theelectronic module 22 and/or at least some functions of the electronicmodule 22 (e.g., data transmission/reception functions, etc.). A widevariety of different activation systems may be used without departingfrom this invention. In any such embodiments, the sensor system 12 maycontain a “sleep” mode, which can deactivate the system 12 after a setperiod of inactivity. In an alternate embodiment, the sensor system 12may operate as a low-power device that does not activate or deactivate.

The module 22 may further be configured for communication with anexternal device 110, which may be an external computer or computersystem, mobile device, gaming system, or other type of electronicdevice, as shown in FIGS. 6 and 10-12. The exemplary external device 110shown in FIG. 5 includes a processor 302, a memory 304, a power supply306, a display 308, a user input 310, and a data transmission/receptionsystem 108. The transmission/reception system 108 is configured forcommunication with the module 22 via the transmission/reception system107 of the module 22, through any type of known electroniccommunication, including the contacted and contactless communicationmethods described above and elsewhere herein. It is understood that themodule 22 and/or the port 14 can be configured for communication with aplurality of external devices, including a wide variety of differenttypes and configurations of electronic devices, and also includingintermediate devices that function to pass information on to anotherexternal device and may or may not further process such data.Additionally, the transmission/reception system 107 of the module 22 maybe configured for a plurality of different types of electroniccommunication. It is further understood that the shoe 100 may include aseparate power source to operate the sensors 16 if necessary, such as abattery, piezoelectric, solar power supplies, or others. In theembodiment of FIGS. 3-8, the sensors 16 receive power through connectionto the module 22.

As described below, such sensor assemblies can be customized for usewith specific software for the electronic module 22 and/or the externaldevice 110. A third party may provide such software along with a soleinsert having a customized sensor assembly, as a package. The module 22and/or the overall sensor system 12 may cooperate with one or morealgorithms for analysis of the data obtained from the sensors 16,including algorithms stored on and/or executed by the module, theexternal device 110, or another component.

In operation, the sensors 16 gather data according to their function anddesign, and transmit the data to the port 14. The port 14 then allowsthe electronic module 22 to interface with the sensors 16 and collectthe data for later use and/or processing. In one embodiment, the data iscollected, stored, and transmitted in a universally readable format, sothe data is able to be accessed and/or downloaded by a plurality ofusers, with a variety of different applications, for use in a variety ofdifferent purposes. In one example, the data is collected, stored, andtransmitted in XML format. In one embodiment, the module 22 detectspressure changes in the sensors 16 utilizing the circuit 10 as shown inFIG. 9, by measuring the voltage drop at the measurement terminal 104 b,which is reflective of the changes in resistance of the particularsensor 16 that is currently switched. FIG. 13 illustrates one example ofa pressure—resistance curve for a sensor 16, with broken linesillustrating potential shifts of the curve due to factors such asbending of the insert 37. The module 22 may have an activationresistance R_(A), which is the detected resistance necessary for themodule 22 to register the pressure on the sensor. The correspondingpressure to produce such resistance is known as the activation pressureP_(A). The activation resistance R_(A) may be selected to correspond toa specific activation pressure P_(A) at which it is desired for themodule 22 to register data. In one embodiment, the activation pressureP_(A) may be about 0.15 bar, about 0.2 bar, or about 0.25 bar, and thecorresponding activation resistance R_(A) may be about 100 kΩ.Additionally, in one embodiment, the highest sensitivity range may befrom 150-1500 mbar. In one embodiment, the sensor system 12 constructedas shown in FIGS. 3-22B can detect pressures in the range of 0.1-7.0 bar(or about 0.1-7.0 atm), and in another embodiment, the sensor system 12may detect pressures over this range with high sensitivity.

In different embodiments, the sensor system 12 may be configured tocollect different types of data. In one embodiment (described above),the sensor(s) 16 can collect data regarding the number, sequence, and/orfrequency of compressions. For example, the system 12 can record thenumber or frequency of steps, jumps, cuts, kicks, or other compressiveforces incurred while wearing the footwear 100, as well as otherparameters, such as contact time and flight time. Both quantitativesensors and binary on/off type sensors can gather this data. In anotherexample, the system can record the sequence of compressive forcesincurred by the footwear, which can be used for purposes such asdetermining foot pronation or supination, weight transfer, foot strikepatterns, or other such applications. In another embodiment (alsodescribed above), the sensor(s) 16 are able to quantitatively measurethe compressive forces on the adjacent portions of the shoe 100, and thedata consequently can include quantitative compressive force and/orimpact measurement. Relative differences in the forces on differentportions of the shoe 100 can be utilized in determining weightdistribution and “center of pressure” of the shoe 100. The weightdistribution and/or center of pressure can be calculated independentlyfor one or both shoes 100, or can be calculated over both shoestogether, such as to find a center of pressure or center of weightdistribution for a person's entire body. In further embodiments, thesensor(s) 16 may be able to measure rates of changes in compressiveforce, contact time, flight time or time between impacts (such as forjumping or running), and/or other temporally-dependent parameters. It isunderstood that, in any embodiment, the sensors 16 may require a certainthreshold force or impact before registering the force/impact, asdescribed above.

As described above, the data is provided through the universal port 14to the module 22 in a universally readable format in one embodiment, sothat the number of applications, users, and programs that can use thedata is nearly unlimited. Thus, the port 14 and module 22 are configuredand/or programmed as desired by a user, and the port 14 and module 22receive input data from the sensor system 12, which data can be used inany manner desired for different applications. The module 22 may be ableto recognize whether the data received is related to a left or rightshoe, such as through the use of a unique identification chip 92. Themodule 22 may process the data differently according to the recognitionof L/R shoe, and may also transmit the data to the external device 110with an identification of whether the data is from a L/R shoe. Theexternal device 110 may likewise process or otherwise handle the datadifferently based on the identification of L/R shoe as well. In oneexample, the connections of the sensors 16 to the terminals 11 and theinterface 20 may be different between the left and right inserts 37, asshown in FIG. 12 and discussed above. The data from the left insert 37may be interpreted differently from the data from the right insert 37 inaccordance with this arrangement. The module 22 and/or the electronicdevice 110 may perform similar actions with respect to other identifyinginformation contained on the unique identification chip 92. In manyapplications, the data is further processed by the module 22 and/or theexternal device 110 prior to use. In configurations where the externaldevice 110 further processes the data, the module 22 may transmit thedata to the external device 110. This transmitted data may betransmitted in the same universally-readable format, or may betransmitted in another format, and the module 22 may be configured tochange the format of the data. Additionally, the module 22 can beconfigured and/or programmed to gather, utilize, and/or process datafrom the sensors 16 for one or more specific applications. In oneembodiment, the module 22 is configured for gathering, utilizing, and/orprocessing data for use in a plurality of applications. Examples of suchuses and applications are given below. As used herein, the term“application” refers generally to a particular use, and does notnecessarily refer to use in a computer program application, as that termis used in the computer arts. Nevertheless, a particular application maybe embodied wholly or partially in a computer program application.

Further, in one embodiment, the module 22 can be removed from thefootwear 100 and replaced with a second module 22 configured foroperating differently than the first module 22. For example, thereplacement is accomplished by lifting the foot contacting member 133,disconnecting the first module 22 from the port 14 and removing thefirst module 22 from the housing 24, then inserting the second module 22into the housing 24 and connecting the second module 22 to the port 14,and finally placing the foot contacting member 133 back into position.The second module 22 may be programmed and/or configured differentlythan the first module 22. In one embodiment, the first module 22 may beconfigured for use in one or more specific applications, and the secondmodule 22 may be configured for use in one or more differentapplications. For example, the first module 22 may be configured for usein one or more gaming applications and the second module 22 may beconfigured for use in one or more athletic performance monitoringapplications. Additionally, the modules 22 may be configured for use indifferent applications of the same type. For example, the first module22 may be configured for use in one game or athletic performancemonitoring application, and the second module 22 may be configured foruse in a different game or athletic performance monitoring application.As another example, the modules 22 may be configured for different useswithin the same game or performance monitoring application. In anotherembodiment, the first module 22 may be configured to gather one type ofdata, and the second module 22 may be configured to gather a differenttype of data. Examples of such types of data are described herein,including quantitative force and/or pressure measurement, relative forceand/or pressure measurement (i.e. sensors 16 relative to each other),weight shifting/transfer, impact sequences (such as for foot strikepatterns) rate of force and/or pressure change, etc. In a furtherembodiment, the first module 22 may be configured to utilize or processdata from the sensors 16 in a different manner than the second module22. For example, the modules 22 may be configured to only gather, store,and/or communicate data, or the modules 22 may be configured to furtherprocess the data in some manner, such as organizing the data, changingthe form of the data, performing calculations using the data, etc. Inyet another embodiment, the modules 22 may be configured to communicatedifferently, such as having different communication interfaces or beingconfigured to communicate with different external devices 110. Themodules 22 may function differently in other aspects as well, includingboth structural and functional aspects, such as using different powersources or including additional or different hardware components, suchas additional sensors as described above (e.g. GPS, accelerometer,etc.).

One use contemplated for the data collected by the system 12 is inmeasuring weight transfer, which is important for many athleticactivities, such as a golf swing, a baseball/softball swing, a hockeyswing (ice hockey or field hockey), a tennis swing, throwing/pitching aball, etc. The pressure data collected by the system 12 can givevaluable feedback regarding balance and stability for use in improvingtechnique in any applicable athletic field. It is understood that moreor less expensive and complex sensor systems 12 may be designed, basedon the intended use of the data collected thereby.

The data collected by the system 12 can be used in measurement of avariety of other athletic performance characteristics. The data can beused to measure the degree and/or speed of foot pronation/supination,foot strike patterns, balance, and other such parameters, which can beused to improve technique in running/jogging or other athleticactivities. With regard to pronation/supination, analysis of the datacan also be used as a predictor of pronation/supination. Speed anddistance monitoring can be performed, which may include pedometer-basedmeasurements, such as contact measurement or loft time measurement. Jumpheight can also be measured, such as by using contact or loft timemeasurement. Lateral cutting force can be measured, includingdifferential forces applied to different parts of the shoe 100 duringcutting. The sensors 16 can also be positioned to measure shearingforces, such as a foot slipping laterally within the shoe 100. As oneexample, additional sensors may be incorporated into the sides of theupper 120 of the shoe 100 to sense forces against the sides.

The data, or the measurements derived therefrom, may be useful forathletic training purposes, including improving speed, power, quickness,consistency, technique, etc., as described in greater detail below. Theport 14, module 22, and/or external device 110 can be configured to givethe user active, real-time feedback. In one example, the port 14 and/ormodule 22 can be placed in communication with a computer, mobile device,etc., in order to convey results in real time. In another example, oneor more vibration elements may be included in the shoe 100, which cangive a user feedback by vibrating a portion of the shoe to help controlmotion, such as the features disclosed in U.S. Pat. No. 6,978,684, whichis incorporated herein by reference and made part hereof. Additionally,the data can be used to compare athletic movements, such as comparing amovement with a user's past movements to show consistency, improvement,or the lack thereof, or comparing a user's movement with the samemovement of another, such as a professional golfer's swing.

The system 12 can also be configured for “all day activity” tracking, torecord the various activities a user engages in over the course of aday. The system 12 may include a special algorithm for this purpose,such as in the module 22, the external device 110, and/or the sensors16. The system 12 may also be used for control applications, rather thandata collection and processing applications, such as for use incontrolling an external device 110, e.g., a computer, television, videogame, etc., based on movements by the user detected by the sensors 16.

A single article of footwear 100 containing the sensor system 12 asdescribed herein can be used alone or in combination with a secondarticle of footwear 100′ having its own sensor system 12′, such as apair of shoes 100, 100′ as illustrated in FIGS. 10-12. The sensor system12′ of the second shoe 100′ generally contains one or more sensors 16′connected by sensor leads 18′ to a port 14′ in communication with anelectronic module 22′. The second sensor system 12′ of the second shoe100′ shown in FIGS. 10-12 has the same configuration as the sensorsystem 12 of the first shoe 100. However, in another embodiment, theshoes 100, 100′ may have sensor systems 12, 12′ having differentconfigurations. The two shoes 100, 100′ are both configured forcommunication with the external device 110, and in the embodimentillustrated, each of the shoes 100, 100′ has an electronic module 22,22′ configured for communication with the external device 110. Inanother embodiment, both shoes 100, 100′ may have ports 14, 14′configured for communication with the same electronic module 22. In thisembodiment, at least one shoe 100, 100′ may be configured for wirelesscommunication with the module 22. FIGS. 10-12 illustrate various modesfor communication between the modules 22, 22′.

FIG. 10 illustrates a “mesh” communication mode, where the modules 22,22′ are configured for communicating with each other, and are alsoconfigured for independent communication with the external device 110.FIG. 11 illustrates a “daisy chain” communication mode, where one module22′ communicates with the external device 110 through the other module22. In other words, the second module 22′ is configured to communicatesignals (which may include data) to the first module 22, and the firstmodule 22 is configured to communicate signals from both modules 22, 22′to the external device 110. Likewise, the external device communicateswith the second module 22′ through the first module 22, by sendingsignals to the first module 22, which communicates the signals to thesecond module 22′. In one embodiment, the modules 22, 22′ can alsocommunicate with each other for purposes other than transmitting signalsto and from the external device 110. FIG. 12 illustrates an“independent” communication mode, where each module 22, 22′ isconfigured for independent communication with the external device 110,and the modules 22, 22′ are not configured for communication with eachother. In other embodiments, the sensor systems 12, 12′ may beconfigured for communication with each other and/or with the externaldevice 110 in another manner.

FIGS. 17-19 illustrate another embodiment of a sensor system 12 for usein an article of footwear. The system 12 in FIGS. 17-19 utilizes aninsert or carrier 200 for insertion into an article of footwear, havinga plurality of sensors 16 connected thereto in positions correspondingto key pressure points on a footwear sole, and also includes a port 14supported by the insert 200 for connection to an electronic module 22.In this embodiment, the sensors 16 may be FSR sensors as describedabove, including contacts 40, 42 disposed on separate layers, whichchange in resistance during compression. The port 14 and module 22 maylikewise utilize a configuration as described above. The insert 200 maybe a sole member for insertion into an article of footwear, such as astrobel, insole, sockliner, etc., and may be made from flexible foam,fabric, rubber, and other such materials, or a combination thereof. Theleads 18 connecting the sensors 16 to the port 14 are created byconductive thread that is sewn into the insert 200 or flexible ink thatcan be deposited on or within the insert 200. One example of such aconductive thread is a nylon yarn coated with a conductive formulation.In other embodiments, different types of conductive threads, such aslycra-based or other elastic conductive threads, could be used. Thesensors 16 may have connection pads 201 that are optimized for a sewnconnection, and also may be backed with a pressure-sensitive adhesive tofacilitate placement on the insert 200. Further, the sensors 16 may besymmetrical, allowing them to be placed medially or laterally. Thesensors 16 may be positioned on the top or bottom surface of the insert200. In another embodiment, the sensors 16 may be positioned within theinsert 200.

The use of conductive threads as leads 18 permit the conductive pathsbetween the sensors 16 and the port 14 have the same mechanicalproperties as the footwear material onto which it is sewn. This, inturn, decouples the motion of the footwear from the materials of thesensor system 12 and increases durability and allows the system 12 to beincorporated into a wider variety of footwear with various flexingcharacteristics. The configuration shown in FIG. 17 also reduces oreliminates the need for a separate insert, reducing material usage andsimplifying assembly, as well as reducing weight and potentiallyincreasing flexibility in the sole. Further, this configuration permitsthe sensors 16 to be incorporated into a wide range of different shoesizes, without specially-dimensioned inserts being necessary forincorporation into different size shoes.

FIGS. 18A-B schematically illustrate the connections between the sensors16 on the insert 200 as shown in FIG. 17. It is understood that thecomponents of FIGS. 18A-B are not drawn to scale. As shown, a singlepower/ground lead 18B connects all the sensors 16 to the power/groundterminal 11A of the port 14, and each sensor 16 is also connected to itsown separate terminal 11. In FIG. 18A, an additional terminal 11 isconnected to the power/ground terminal 11A, with a resistor 102 locatedtherebetween. In FIG. 18B, the resistor 102 is located between the finalterminal 11 and the heel sensor 16. FIG. 19 illustrates a circuit 204that may be associated with the system 12 as illustrated in FIGS. 17-18,which is similar to the circuit 10 of FIG. 9, except that the circuit204 includes only a single resistor 102 (but could include parallelresistors in another embodiment).

FIGS. 20-23 illustrate another embodiment of a sensor system 12 for usein an article of footwear. The system 12 in FIGS. 20-23 utilizes aninsert 600 that may be a single-layer sheet of polymer webbing or film(e.g. Mylar) as described above, having sensors 16 connected thereto.The sensors 16 in this embodiment may be FSR sensors as described above,including contacts 40, 42 disposed on separate layers, which change inresistance during compression. The sensors 16 may each be separatelyformed, as similarly shown in FIG. 17 and FIG. 22, in a two-layerconfiguration, with the contacts 40, 42 printed on the separate layers,and each sensor 16 can be individually connected to the insert 600. Thesensors 16 may have adhesive backing for connection to the insert 600,as shown in FIG. 21 and as also described above. The insert 600 furtherhas leads 18 formed by conductive traces printed on the insert 600, andsuch conductive traces may be exposed, if the insert 600 is a singlelayer. Further, the insert 600 can be formed integrally within a solemember 601, such as a sockliner, and may be laminated between twomembrane layers (not shown) of the sole member 601, e.g., TPU layers.The sensors 16 are thereby sealed within the sole member 601, and canvent into the sole member 601 without risk of contamination, as the solemember 601 is sealed. The system 12 further includes a port 14 connectedto the sensors 16 through the leads 18, which is also in communicationwith an electronic module 602 as described below.

FIG. 22 illustrates one embodiment of a sensor 16, having two electrodes40, 42, disposed on substrate layers 603A,B, with each electrode 40, 42having a plurality of segments 1-5 connected by one or more distributionleads 18A, 18E. It is understood that the electrodes 40, 42 arepositioned in superimposed relation, with the first electrode 40positioned on the top surface of the bottom substrate layer 603A and thesecond electrode 42 positioned on the bottom surface of the topsubstrate layer 603B, as similarly described elsewhere herein. As seenin FIG. 22, the first electrode 40 has two electrically separateportions 605, 606, each with a separate distribution lead 18A, where oneportion 605 includes segments 2 and 4 and the other portion 606 includessegments 1, 3, and 5. The first portion 605 is connected to an inputlead 18C and the second portion 606 is connected to an output lead 18D(or vice versa), both of which leads 18C,D are in connection with thebottom substrate layer 603A. The second electrode 42 has a singledistribution lead 18E. The schematic in FIG. 22 illustrates the signalpath through the sensor 16, incoming from the lead 18C in contact withthe bottom substrate 603A, through the first portion 605 of the firstelectrode 40, to the corresponding segment of the second electrode 42 onthe top substrate 603B, and then back through the second portion 606 ofthe first electrode 40 and through the output lead 18D. Accordingly, asillustrated in FIG. 22, each sensor 16 represents two separate resistors(i.e. segments 2, 4) in parallel, placed in series with three separateresistors (i.e., segments 1, 3, 5) in parallel. It is understood thatthis same or a similar sensor configuration may be used in theembodiment of FIG. 17 as described above. The sensors 16 and the port 14in this embodiment may be connected together in the same manner shownand described in FIGS. 18-19. Other configurations may be used in otherembodiments.

The module 602 in the embodiment of FIGS. 20-23 is permanently connectedto the sole member 601, and may be partially or completely enclosedwithin the sole member 601 and/or the sole member 601 in combinationwith one or more other sole members (e.g., midsole). In the embodimentof FIGS. 20-22, the module 602 is overmolded within the arch area of thesole, and may be partially or completely enclosed by the sole member601. The module 602 has the port 14 in connection with the sensor leads18 as described in other embodiments herein. It is understood that themodule 602 may include at least any/all of the functional components andfeatures described elsewhere herein with respect to the electronicmodule 22. In an alternate embodiment, the system 12 of FIGS. 20-23 mayhave a removable electronic module 22 and a housing 24 for receiving themodule 22, as described herein and shown e.g., in FIGS. 14A-16.

Additionally, a connector 607 is provided in communication with themodule 602 in the embodiment of FIGS. 20-23, in order to provideexternal electrical communication with the module 602. In thisembodiment, the sole member 601 may have the connector 607 in the formof a tail that extends from the heel area of the sole member 601 and isin electrical communication with the module 602. The connector 607 isexternally exposed, to provide a physical connection to externalelectronic equipment. The connector 607 is configured to be engaged byan external connector, such as a “snakebite” connector, and may havecontacts and other structure configured for connection to a specificexternal connector. The module 602 can thereby communicate with anexternal device to send or receive information (e.g., softwareupdates/reset), and the connector 607 can also be used for batterycharging. It is understood that the module 602 may also be configuredfor wireless communication, as described elsewhere herein. In oneembodiment, the connector 607 may be accessible within the shoe cavity,and in another embodiment, the connector 607 may be accessible from theoutside of the sole, such as being exposed through one of the externalwalls of the sole. If the connector 607 is located within the shoecavity, it is understood that it may be located beneath the sole member601 or beneath another sole member that may be lifted to access theconnector 607. In another embodiment, communication with the module 602may be exclusively wireless, and power charging may be wireless as well(e.g., inductive charging, kinetic charging, etc.).

The configuration of the sensors 16 and leads 18 in the insert 600 ofFIGS. 20-23 requires less surface area for connection than otherconfigurations described herein. Therefore, the insert 600 in thisembodiment may utilize less material and may have additional cut-outportions that can provide additional flexibility and/or tearingmitigation for the insert 600. For example, FIG. 23 illustrates aninsert 600 that is usable with the system 12 of FIGS. 20-23 and includesa deeper cut-out 608 on the peripheral edge thereof than otherembodiments described herein. It is understood that other areas of theinsert 600 may also potentially be removed, depending on theconfiguration of the conductive traces.

FIGS. 24-25 illustrate another embodiment of a sensor system 12 for usein an article of footwear. The system 12 in FIGS. 24-25 utilizes acarrier or insert 400 having a plurality of sensors 16 connected theretoin positions corresponding to key pressure points on a footwear sole.The insert 400 may be configured similarly to the insert 600 of FIG. 20,i.e., the insert 400 may be connected or bonded to or function as a solemember for insertion into an article of footwear, such as a strobel,insole, sockliner, etc. In one embodiment, the insert 400 is a flexiblefoam or fabric layer having the sensors 16 connected thereto, which canbe laminated into a sockliner or other sole member. The leads 18connecting the sensors 16 to the port 14 may be created by conductivethread that is sewn into the insert 400 or the sole member to which itis bonded or flexible ink that can be deposited on or within the insert400, as similarly described above with respect to FIG. 17. Such sensorsdecouple the motion of the sole from the sensor materials, as describedabove with respect to FIG. 17. In this embodiment, the sensors 16 arepiezoelectric sensors, which create a voltage when deformed. The system12 of FIGS. 24-25 further includes a port 14 in communication with anelectronic module 401 that may be permanently connected within the soleas described above with respect to the module 602 of FIGS. 20-23 (e.g.,by overmolding). As also described above, the module 401 may include aconnector 402 to provide a physical connection to external electronicequipment. Another type of module may alternately be used, such as aremovable module 22 as described above and shown, e.g., in FIGS. 14A-16.

The piezoelectric sensors 16 as used in the embodiment of FIGS. 24-25may be constructed in a variety of manners, including at least onepiezoelectric material. One example of a piezoelectric material that maybe used in the sensors 16 is polyvinylidene difluoride (PVDF), howeverother materials may be used as well. In this embodiment, each sensor 16has two leads 18 connected thereto, and deformation of the piezoelectricmaterial generates a voltage across the two leads 18. FIG. 25illustrates one potential configuration of a piezoelectric sensor 16that may be used in connection with the system 12 of FIG. 24. The sensor16 in FIG. 25 includes a piezoelectric material 403 that may havemetallization 404 on both sides to create a conductive surface forcontact by the leads 18, surrounded by polymer layers 405 for supportand protection. It is understood that FIG. 25 is schematic. Thepiezoelectric sensors 16 may be separate sensors connected to the insert400 by adhesive, stitching, or other technique. In another embodiment,the outer piezoelectric material 403 and metallization may be containedbetween the layers of a two-layer Mylar insert, which can serve as theprotective polymer layers 405.

The use of the piezoelectric sensors 16 in the embodiment of FIGS. 24-25produces several advantages. For example, the sensors 16 are extremelythin and flexible, and can be easily sealed and/or laminated directlyinto footwear components in nearly any location. Additionally, thesensors 16 do not require power, as the piezoelectric effect causes thesensors 16 to generate a voltage. This effect may also be used forenergy harvesting, e.g., for charging the module 401. Further, thepiezoelectric effect can work in reverse, i.e., the sensor 16 may deformwhen a voltage is applied. This effect can be used to generatetactile/haptic feedback that is detectable by the user through sense oftouch, e.g., a slight vibration. The sensors are also symmetrical, andcan be used in any orientation. The connection pads of the sensors 16may also be optimized for overlay of the ink or thread of the leads.

FIGS. 26-28 illustrate another embodiment of a sensor system 12 for usein an article of footwear. The system 12 in FIGS. 26-28 utilizes acarrier or insert 500 that may be similar to any of the inserts 200,600, 400 described above and shown in FIGS. 17-25. In this embodiment,the system 12 utilizes multiple piezoelectric film strips 501 thatfunction as sensors for sensing flexing of the sole of the article offootwear. The plurality of film strips 501 are arranged to mimic theskeletal shape of the human foot, and the strips 501 are arranged tohave different lengths. The strips 501 may be directly connected to theelectronic components 502 of the system 12, which may include a port 14and an electronic module according to any of the embodiments describedabove (e.g., a removable module 22 as in FIGS. 14A-16, an overmoldedmodule 600 as in FIGS. 20-23, etc.). In another embodiment, conductiveleads may be used to connect the piezoelectric strips 501 to theelectronic components 502. FIG. 26 illustrates one embodiment of thesensor system 12 incorporating the piezoelectric strips 501, and FIG. 27illustrates another embodiment that utilizes a smaller number ofpiezoelectric strips 501, for a simpler and less expensive construction.The strips 501 may have a construction similar to the sensors 16 asillustrated in FIG. 25, in one embodiment.

FIG. 28 illustrates the functioning of the sensor system 12 of FIG. 26.Two different sole flex lines F1, F2 are illustrated in FIG. 28, and theconfiguration of the strips 501 provides the ability to distinguishbetween the two flex lines F1, F2. The first flex line F1 only causesdeformation of two of the longest strips 501, and does not causedeformation of any of the other strips 501. The electronic components502 can thereby determine the location of the flex line F1, based onwhich strips 501 were deformed and which strips 501 were not. The secondflex area F2 deforms a greater number of strips 501, and the location ofthis flex line F2 can be determined in the same manner. The degree offlexing of the sole can then be determined by the distance between thetwo flex lines F1, F2. A small flex of the sole will create a small flexarea, and the flex axes (e.g., flex lines F1, F2) will be close togetherand often near the forefoot. A large flex of the sole will create alarge flex area, and the flex axes will be farther apart and may bewithin the midfoot area. Thus, the system 12 can determine the flexlocation and the degree of flexing by using the strips 501 configured asshown. The piezoelectric strips 501 can also produce advantages asdescribed above, such as thin size, flexibility, etc., as well as use inenergy harvesting and/or haptic feedback.

As will be appreciated by one of skill in the art upon reading thepresent disclosure, various aspects described herein may be embodied asa method, a data processing system, or a computer program product.Accordingly, those aspects may take the form of an entirely hardwareembodiment, an entirely software embodiment or an embodiment combiningsoftware and hardware aspects. Furthermore, such aspects may take theform of a computer program product stored by one or more tangiblecomputer-readable storage media or storage devices havingcomputer-readable program code, or instructions, embodied in or on thestorage media. Any suitable tangible computer readable storage media maybe utilized, including hard disks, CD-ROMs, optical storage devices,magnetic storage devices, and/or any combination thereof. In addition,various intangible signals representing data or events as describedherein may be transferred between a source and a destination in the formof electromagnetic waves traveling through signal-conducting media suchas metal wires, optical fibers, and/or wireless transmission media(e.g., air and/or space).

As described above, aspects of the present invention may be described inthe general context of computer-executable instructions, such as programmodules, being executed by a computer and/or a processor thereof.Generally, program modules include routines, programs, objects,components, data structures, etc. that perform particular tasks orimplement particular abstract data types. Such a program module may becontained in a tangible, non-transitory computer-readable medium, asdescribed above. Aspects of the present invention may also be practicedin distributed computing environments where tasks are performed byremote processing devices that are linked through a communicationsnetwork. Program modules may be located in a memory, such as the memory204 of the module 22 or memory 304 of the external device 110, or anexternal medium, such as game media, which may include both local andremote computer storage media including memory storage devices. It isunderstood that the module 22, the external device 110, and/or externalmedia may include complementary program modules for use together, suchas in a particular application. It is also understood that a singleprocessor 202, 302 and single memory 204, 304 are shown and described inthe module 22 and the external device 110 for sake of simplicity, andthat the processor 202, 302 and memory 204, 304 may include a pluralityof processors and/or memories respectively, and may comprise a system ofprocessors and/or memories.

Several alternative embodiments and examples have been described andillustrated herein. A person of ordinary skill in the art wouldappreciate the features of the individual embodiments, and the possiblecombinations and variations of the components. A person of ordinaryskill in the art would further appreciate that any of the embodimentscould be provided in any combination with the other embodimentsdisclosed herein. It is understood that the invention may be embodied inother specific forms without departing from the spirit or centralcharacteristics thereof. The present examples and embodiments,therefore, are to be considered in all respects as illustrative and notrestrictive, and the invention is not to be limited to the details givenherein. The terms “first,” “second,” “top,” “bottom,” etc., as usedherein, are intended for illustrative purposes only and do not limit theembodiments in any way. Additionally, the term “plurality,” as usedherein, indicates any number greater than one, either disjunctively orconjunctively, as necessary, up to an infinite number. Further,“Providing” an article or apparatus, as used herein, refers broadly tomaking the article available or accessible for future actions to beperformed on the article, and does not connote that the party providingthe article has manufactured, produced, or supplied the article or thatthe party providing the article has ownership or control of the article.Accordingly, while specific embodiments have been illustrated anddescribed, numerous modifications come to mind without significantlydeparting from the spirit of the invention and the scope of protectionis only limited by the scope of the accompanying Claims.

What is claimed is:
 1. A sensor system comprising: a sole memberconfigured to form part of a sole structure of an article of footwear; aflexible insert member positioned in contact with the sole member, theflexible insert member comprising a single thin, flexible sheet; a portconnected to the insert member and configured for communication with anelectronic module; a plurality of sensors connected to the insertmember, each sensor comprising a first layer and a second layer, with afirst contact located on the first layer and a second contact located onthe second layer, the second contact being generally aligned with thefirst contact, wherein the sensors are each configured such thatpressure on the sensor changes a resistance of the sensor, wherein eachsensor is connected to an outer surface of the insert member by abonding material; and a plurality of leads connected to the insertmember, the leads connecting the sensors to the port.
 2. The sensorsystem of claim 1, wherein each sensor is adhesively bonded to the outersurface of the insert member.
 3. The sensor system of claim 1, furthercomprising an electronic module connected to the port, wherein theelectronic module is overmolded within the sole member and completelycontained within the sole member, wherein the electronic module isconfigured for communication with an external device.
 4. The sensorsystem of claim 3, further comprising an external connector that iselectrically connected to the electronic module, wherein the externalconnector is exposed to an exterior of the sole member and is accessiblefrom the exterior of the sole member to provide a physical electricalconnection to the electronic module.
 5. The sensor system of claim 4,wherein the external connector comprises a tail that extends from a heelarea of the sole member.
 6. The sensor system of claim 1, wherein theleads are formed by conductive traces printed on the outer surface ofthe insert.
 7. The sensor system of claim 1, wherein the sole member issealed around the insert member.
 8. The sensor system of claim 7,wherein the sole member comprises upper and lower membrane layers, andthe insert member is laminated between the upper and lower membranelayers.
 9. The sensor system of claim 1, wherein the first contact ofeach sensor includes two electrically separate portions, with leadsconnected to each of the two electrically separate portions, and whereinthe second contact of each sensor engages both of the two electricallyseparate portions of the first sensor.
 10. A sensor system comprising: asole member configured to form part of a sole structure of an article offootwear; a flexible insert member contained within the sole member,wherein the sole member is sealed around the insert member; a portconnected to the insert member and configured for communication with anelectronic module; a plurality of sensors connected to the insertmember, each sensor configured such that pressure on the sensor changesa resistance of the sensor; and a plurality of leads connected to theinsert member, the leads connecting the sensors to the port.
 11. Thesensor system of claim 10, wherein each sensor is connected to an outersurface of the insert member by a bonding material.
 12. The sensorsystem of claim 10, further comprising an electronic module connected tothe port, wherein the electronic module is overmolded within the solemember and completely enclosed by the sole member, and wherein theelectronic module is configured for communication with an externaldevice.
 13. The sensor system of claim 12, further comprising anexternal connector that is electrically connected to the electronicmodule, wherein the external connector is exposed to an exterior of thesole member and is accessible from the exterior of the sole member toprovide a physical electrical connection to the electronic module. 14.The sensor system of claim 13, wherein the external connector comprisesa tail that extends from a heel area of the sole member.
 15. The sensorsystem of claim 10, wherein the sole member comprises upper and lowermembrane layers, and the insert member is laminated between the upperand lower membrane layers to seal the insert member within the solemember.
 16. The sensor system of claim 15, further comprising anelectronic module connected to the port, wherein the electronic moduleis overmolded within the sole member, and wherein the electronic moduleis configured for communication with an external device.
 17. The sensorsystem of claim 10, wherein each sensor comprises a first layer and asecond layer, with a first contact located on the first layer and asecond contact located on the second layer, the second contact beinggenerally aligned with the first contact.
 18. The sensor system of claim17, wherein the insert member is a single thin, flexible sheet, andwherein the sensors are connected to an outer surface of the insertmember.
 19. The sensor system of claim 18, wherein the first contact ofeach sensor includes two electrically separate portions, with leadsconnected to each of the two electrically separate portions, and whereinthe second contact of each sensor engages both of the two electricallyseparate portions of the first sensor, and wherein the leads compriseconductive traces formed on the outer surface of the insert member. 20.An article of footwear comprising: an upper member at least partiallydefining a foot-receiving chamber; a sole structure engaged with theupper member, the sole structure comprising a sole member; a flexibleinsert member positioned in contact with the sole member, the flexibleinsert member comprising a single thin, flexible sheet; and a sensorsystem comprising: a port connected to the insert member and configuredfor communication with an electronic module; a plurality of sensorsconnected to the insert member, each sensor comprising a first layer anda second layer, with a first contact located on the first layer and asecond contact located on the second layer, the second contact beinggenerally aligned with the first contact, wherein the sensors are eachconfigured such that pressure on the sensor changes a resistance of thesensor, wherein each sensor is connected to an outer surface of theinsert member by a bonding material; and a plurality of leads connectedto the insert member, the leads connecting the sensors to the port. 21.The article of footwear of claim 20, wherein each sensor is adhesivelybonded to the outer surface of the insert member.
 22. The article offootwear of claim 20, further comprising an electronic module connectedto the port, wherein the electronic module is overmolded within the solemember and completely contained within the sole member, and wherein theelectronic module is configured for communication with an externaldevice.
 23. The article of footwear of claim 22, further comprising anexternal connector that is electrically connected to the electronicmodule, wherein the external connector is exposed to an exterior of thesole member and is accessible from the exterior of the sole member toprovide a physical electrical connection to the electronic module. 24.The article of footwear of claim 23, wherein the external connectorcomprises a tail that extends from a heel area of the sole member. 25.The article of footwear of claim 20, wherein the leads are formed byconductive traces printed on the outer surface of the insert.
 26. Thearticle of footwear of claim 20, wherein the sole member is sealedaround the insert member.
 27. The article of footwear of claim 26,wherein the sole member comprises upper and lower membrane layers, andthe insert member is laminated between the upper and lower membranelayers.
 28. The article of footwear of claim 20, wherein the firstcontact of each sensor includes two electrically separate portions, withleads connected to each of the two electrically separate portions, andwherein the second contact of each sensor engages both of the twoelectrically separate portions of the first sensor.
 29. An article offootwear comprising: an upper member at least partially defining afoot-receiving chamber; a sole structure engaged with the upper member,the sole structure comprising a sole member; a flexible insert membercontained within the sole member, wherein the sole member is sealedaround the insert member; and a sensor system comprising: a portconnected to the insert member and configured for communication with anelectronic module; a plurality of sensors connected to the insertmember, each sensor configured such that pressure on the sensor changesa resistance of the sensor; and a plurality of leads connected to theinsert member, the leads connecting the sensors to the port.
 30. Thearticle of footwear of claim 29, wherein each sensor is connected to anouter surface of the insert member by a bonding material.
 31. Thearticle of footwear of claim 29, further comprising an electronic moduleconnected to the port, wherein the electronic module is overmoldedwithin the sole member and completely contained within the sole member,and wherein the electronic module is configured for communication withan external device.
 32. The article of footwear of claim 31, furthercomprising an external connector that is electrically connected to theelectronic module, wherein the external connector is exposed to anexterior of the sole member and is accessible from the exterior of thesole member to provide a physical electrical connection to theelectronic module.
 33. The article of footwear of claim 32, wherein theexternal connector comprises a tail that extends from a heel area of thesole member.
 34. The article of footwear of claim 29, wherein the solemember comprises upper and lower membrane layers, and the insert memberis laminated between the upper and lower membrane layers to seal theinsert member within the sole member.
 35. The sensor system of claim 34,further comprising an electronic module connected to the port, whereinthe electronic module is overmolded within the sole member, and whereinthe electronic module is configured for communication with an externaldevice.
 36. The article of footwear of claim 29, wherein each sensorcomprises a first layer and a second layer, with a first contact locatedon the first layer and a second contact located on the second layer, thesecond contact being generally aligned with the first contact.
 37. Thearticle of footwear of claim 36, wherein the insert member is a singlethin, flexible sheet, and wherein the sensors are connected to an outersurface of the insert member.
 38. The article of footwear of claim 37,wherein the first contact of each sensor includes two electricallyseparate portions, with leads connected to each of the two electricallyseparate portions, and wherein the second contact of each sensor engagesboth of the two electrically separate portions of the first sensor, andwherein the leads comprise conductive traces formed on the outer surfaceof the insert member.